link to page 6 link to page 6 link to page 6 link to page 15 link to page 6 link to page 6 link to page 6 link to page 15 link to page 6 link to page 15 link to page 6 link to page 6 link to page 15 link to page 6 Data SheetADMV7710PIN CONFIGURATION AND FUNCTION DESCRIPTIONS45678910111213141516171819AAAANDNDNDNDNDNDNDNDGGGGGGGGGG1DD1AGG2DD2AGG3DD3AGG4DD4AVVVVVVVVGND 20RFOUT 21GND322GNDADMV7710TOP VIEW(Not to Scale)2RFIN1GNDBBBBETEFGG1NDDD1BNDGG2NDDD2BNDGG3NDDD3BNDGG4NDDD4BNDVGVGVGVGVGVGVGVGVDVR 002 403938373635343332313029282726252423 16408- Figure 2. Pad Configuration Table 4. Pad Function Descriptions Pad No.MnemonicDescription 1, 3, 5, 7, 9, 11, 13, GND Ground Connection (See Figure 3). 15, 17, 19, 20, 22, 25, 27, 29, 31, 33, 35, 37, 39 2 RFIN RF Input. AC-couple RFIN and match it to 50 Ω (see Figure 4). 4, 8, 12, 16 VGG1A to VGG4A First Stage Gate Bias Voltage for the Power Amplifier (See Figure 8). For the required external components, see Figure 47. 6, 10, 14, 18 VDD1A to VDD4A First Stage Drain Bias Voltage for the Power Amplifier (See Figure 5). 21 RFOUT RF Output. AC-couple RFOUT and match it to 50 Ω (see Figure 6). 23 VREF Reference Voltage for the Power Detector (See Figure 7). VREF is the dc bias of the diode biased through an external resistor used for temperature compensation of VDET. Refer to the typical application circuit (see Figure 47) for the required external components. 24 VDET Detector Voltage for the Power Detector (See Figure 7). VDET is the dc voltage representing the RF output power rectified by the diode, which is biased through an external resistor. Refer to the typical application circuit (see Figure 47) for the required external components. 26, 30, 34, 38 VDD4B to VDD1B Second Stage Drain Bias Voltage for the Power Amplifier (See Figure 5). 28, 32, 36, 40 VGG4B to VGG1B Second Stage Gate Bias Voltage for the Power Amplifier (See Figure 8). For the required external components, see Figure 47. Die Bottom GND Ground. The die bottom must be connected to the RF/dc ground (see Figure 3). Rev. A | Page 5 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE