Datasheet ADMV7710 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 71 GHz to 76 GHz, 1 Watt E-Band Power Amplifier With Power Detector |
| 页数 / 页 | 18 / 7 — Data Sheet. ADMV7710. TYPICAL PERFORMANCE CHARACTERISTICS. TA = +85°C. TA … |
| 修订版 | A |
| 文件格式/大小 | PDF / 311 Kb |
| 文件语言 | 英语 |
Data Sheet. ADMV7710. TYPICAL PERFORMANCE CHARACTERISTICS. TA = +85°C. TA = +25°C. INPUT RETURN LOSS. TA = –55°C. GAIN
该数据表的模型线
文件文字版本
Data Sheet ADMV7710 TYPICAL PERFORMANCE CHARACTERISTICS 30 0 25 TA = +85°C 20 –5 TA = +25°C INPUT RETURN LOSS TA = –55°C 15 GAIN B) OUTPUT RETURN LOSS d ( ) 10 –10 S B S 5 O SE (d N 0 –15 URN L T –5 ESPO RE R –10 –20 UT –15 INP –20 –25 –25 –30 –30 69 70 71 72 73 74 75 76 77 78
009
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
012
FREQUENCY (GHz)
16408-
FREQUENCY (GHz)
16408- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, IDD = 800 mA Figure 12. Input Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA
30 0 28 –2 TA = +85°C TA = +25°C 26 T –4 A = –55°C B) d 24 ( –6 S S 22 O –8 B) d 20 N ( URN L –10 AI T G 18 RE –12 TA = +85°C UT 16 T P A = +25°C –14 TA = –55°C UT 14 O –16 12 –18 10 –20 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
010
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
013
FREQUENCY (GHz)
16408-
FREQUENCY (GHz)
16408- Figure 10. Gain vs. Frequency over Various Temperatures, IDD = 800 mA Figure 13. Output Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA
30 –30 28 TA = +85°C –35 TA = +25°C 26 TA = –55°C ) –40 B 24 (d N –45 22 IO B) T d A L 20 N ( –50 AI SO G 18 SE I –55 500mA 16 600mA 700mA EVER R –60 14 800mA 900mA –65 12 10
1
–70
1
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
014
FREQUENCY (GHz)
16408-
FREQUENCY (GHz)
16408- Figure 11. Gain vs. Frequency over IDD Figure 14. Reverse Isolation vs. Frequency over Various Temperatures, IDD = 800 mA Rev. A | Page 7 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
009
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
012
FREQUENCY (GHz)
16408-
FREQUENCY (GHz)
16408- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, IDD = 800 mA Figure 12. Input Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA
30 0 28 –2 TA = +85°C TA = +25°C 26 T –4 A = –55°C B) d 24 ( –6 S S 22 O –8 B) d 20 N ( URN L –10 AI T G 18 RE –12 TA = +85°C UT 16 T P A = +25°C –14 TA = –55°C UT 14 O –16 12 –18 10 –20 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
010
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
013
FREQUENCY (GHz)
16408-
FREQUENCY (GHz)
16408- Figure 10. Gain vs. Frequency over Various Temperatures, IDD = 800 mA Figure 13. Output Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA
30 –30 28 TA = +85°C –35 TA = +25°C 26 TA = –55°C ) –40 B 24 (d N –45 22 IO B) T d A L 20 N ( –50 AI SO G 18 SE I –55 500mA 16 600mA 700mA EVER R –60 14 800mA 900mA –65 12 10
1
–70
1
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
014
FREQUENCY (GHz)
16408-
FREQUENCY (GHz)
16408- Figure 11. Gain vs. Frequency over IDD Figure 14. Reverse Isolation vs. Frequency over Various Temperatures, IDD = 800 mA Rev. A | Page 7 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE