Datasheet HMC637BPM5E (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC, Single Positive Supply, DC to 7.5 GHz, 1 W Power Amplifier |
| 页数 / 页 | 21 / 4 — HMC637BPM5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 691 Kb |
| 文件语言 | 英语 |
HMC637BPM5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter1. Rating. Table 3. Thermal Resistance
该数据表的模型线
文件文字版本
link to page 5 link to page 5
HMC637BPM5E Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter1 Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (V (PCB) design and operating environment. Careful attention to DD) 14 V Gate 1 Voltage (V PCB thermal design is required. GG1) −2 V to +1 V Gate 2 Voltage (VGG2) 3.5 V to 7 V θJC is the junction to case thermal resistance. Radio Frequency (RF) Input Power (RFIN) 25 dBm Continuous Power Dissipation (P
Table 3. Thermal Resistance
DISS), 5.7 W T = 85°C (Derate 63.29 mW/°C
Package θJC Unit
Above 85°C) CG-32-21 15.8 °C/W Output Load Voltage Standing Wave 7:1 Ratio (VSWR) 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with 36 thermal vias. See JEDEC JESD51. Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +85°C
ESD CAUTION
Maximum Peak Reflow Temperature 260°C ESD Sensitivity Human Body Model (HBM) Class 1C Junction Temperature to Maintain 175°C 1 Million Hour Mean Time to Failure (MTTF) Nominal Junction Temperature 148.52°C (T = 85°C, V DD = 12 V) 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin names of the multifunction pins, refer to the Pin Configuration and Function Descriptions section. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 4 of 21 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS FREQUENCY RANGE = DC TO 7.5 GHz ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT EVALUATION PCB BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE
HMC637BPM5E Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter1 Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (V (PCB) design and operating environment. Careful attention to DD) 14 V Gate 1 Voltage (V PCB thermal design is required. GG1) −2 V to +1 V Gate 2 Voltage (VGG2) 3.5 V to 7 V θJC is the junction to case thermal resistance. Radio Frequency (RF) Input Power (RFIN) 25 dBm Continuous Power Dissipation (P
Table 3. Thermal Resistance
DISS), 5.7 W T = 85°C (Derate 63.29 mW/°C
Package θJC Unit
Above 85°C) CG-32-21 15.8 °C/W Output Load Voltage Standing Wave 7:1 Ratio (VSWR) 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with 36 thermal vias. See JEDEC JESD51. Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +85°C
ESD CAUTION
Maximum Peak Reflow Temperature 260°C ESD Sensitivity Human Body Model (HBM) Class 1C Junction Temperature to Maintain 175°C 1 Million Hour Mean Time to Failure (MTTF) Nominal Junction Temperature 148.52°C (T = 85°C, V DD = 12 V) 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin names of the multifunction pins, refer to the Pin Configuration and Function Descriptions section. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 4 of 21 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS FREQUENCY RANGE = DC TO 7.5 GHz ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT EVALUATION PCB BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE