Datasheet ADPA7001CHIPS (Analog Devices)

50 GHz to 95 GHz, GaAs, pHEMT, MMIC, Wideband Power Amplifier Data Sheet ADPA7001CHIPS FEATURES FUNCTIONAL BLOCK DIAGRAM Gain: 14.5 dB typical at 50 GHz to 70 GHz 2 3 4 5 6 7 A A S11: 22 dB typical at 50 GHz to 70 GHz 12 1A 2A 34 3A 4A DD DD DD DD S22: 19 dB typical at 50 GHz to 70 GHz GG V V GG V V V V P1dB: 17 dBm typical at 50 GHz to 70 GHz PSAT: 21 dBm typical OIP3: 25 dBm typical at 70 GHz to 90 GHz Supply voltage: 3.5 V at 350 mA 50 Ω matched input/output RFOUT Die size: 2.5 mm × 3.32 mm × 0.05 mm 8 ADPA7001CHIPS APPLICATIONS Test instrumentation Military and space Telecommunications infrastructure 1 RFIN B B 12 1B 2B 34 3B 4B GG DD DD GG DD DD REF DET V V V V V V V V
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16 15 14 13 12 11 10 9
895 16 Figure 1.
GENERAL DESCRIPTION
The ADPA7001CHIPS is a gallium arsenide (GaAs), pseudo- In the upper band of 70 GHz to 90 GHz, the ADPA7001CHIPS morphic high electron mobility transistor (pHEMT), monolithic provides 14 dB (typical) of gain, 25 dBm output IP3, and microwave integrated circuit (MMIC), balanced medium power 17.5 dBm of output power for 1 dB gain compression. The amplifier, with an integrated temperature compensated on-chip ADPA7001CHIPS requires 350 mA from a 3.5 V supply. The power detector that operates from 50 GHz to 95 GHz. In the ADPA7001CHIPS amplifier inputs/outputs are internally matched lower band of 50 GHz to 70 GHz, the ADPA7001CHIPS provides to 50 Ω, facilitating integration into multichip modules (MCMs). 14.5 dB (typical) of gain, 25.5 dBm output third-order intercept All data is taken with the chip connected via one 0.076 mm (3 mil) (OIP3), and 17 dBm of output power for 1 dB gain compression. ribbon bond of 0.076 mm (3 mil) minimal length.
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Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS 50 GHz TO 70 GHz FREQUENCY RANGE 70 GHz TO 90 GHz FREQUENCY RANGE 90 GHz TO 95 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE