HMC1114Data SheetTYPICAL PERFORMANCE CHARACTERISTICS4040303620) B10S22S2132S11SE (ddB)N0N ( AI G+85°CESPO–1028+25°CR–40°C–2024–30–40202.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 4.00 4.25 4.50 008 2.62.83.03.23.43.63.84.0 011 FREQUENCY (GHz) 13530- FREQUENCY (GHz) 13530- Figure 8. Response (Gain and Return Loss) vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures 00–5–10–5SS (dB)SS (dB)–15OO–20–10TURN LTURN L+85°CRE–25RE+25°CUT+85°CPUT–40°CINP–30+25°CUT–15–40°CO–35–40–202.62.83.03.23.43.63.84.0 009 2.62.83.03.23.43.63.84.0 012 FREQUENCY (GHz) 13530- FREQUENCY (GHz) 13530- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures 404036363232dB)dB)N (N (AI32VAI300mAG2828VG28225mA25V150mA20V100mA242420202.62.83.03.23.43.63.84.0 010 2.62.83.03.23.43.63.84.0 013 FREQUENCY (GHz) 13530- FREQUENCY (GHz) 13530- Figure 10. Gain vs. Frequency at Various Supply Voltages Figure 13. Gain vs. Frequency at Various Supply Currents Rev. A | Page 6 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL SUPPLY CURRENT BY VDD ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCE During Power-Up During Power-Down TYPICAL APPLICATION CIRCUIT EVALUATION PRINTED CIRCUIT BOARD (PCB) BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE