Datasheet HMC1114 (Analog Devices) - 6

制造商Analog Devices
描述10 W, GaN Power Amplifier, 2.7 GHz to 3.8 GHz
页数 / 页15 / 6 — HMC1114. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. ) B. S22. S21. …
修订版A
文件格式/大小PDF / 320 Kb
文件语言英语

HMC1114. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. ) B. S22. S21. S11. SE (d. dB). N ( AI G. +85°C. ESPO. –10. +25°C. –40°C. –20. –30. –40

HMC1114 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS ) B S22 S21 S11 SE (d dB) N ( AI G +85°C ESPO –10 +25°C –40°C –20 –30 –40

该数据表的模型线

文件文字版本

HMC1114 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 40 40 30 36 20 ) B 10 S22 S21 32 S11 SE (d dB) N 0 N ( AI G +85°C ESPO –10 28 +25°C R –40°C –20 24 –30 –40 20 2.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 4.00 4.25 4.50
008
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
011
FREQUENCY (GHz)
13530-
FREQUENCY (GHz)
13530- Figure 8. Response (Gain and Return Loss) vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 –5 –10 –5 SS (dB) SS (dB) –15 O O –20 –10 TURN L TURN L +85°C RE –25 RE +25°C UT +85°C PUT –40°C INP –30 +25°C UT –15 –40°C O –35 –40 –20 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
009
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
012
FREQUENCY (GHz)
13530-
FREQUENCY (GHz)
13530- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
40 40 36 36 32 32 dB) dB) N ( N ( AI 32V AI 300mA G 28 28V G 28 225mA 25V 150mA 20V 100mA 24 24 20 20 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
010
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
013
FREQUENCY (GHz)
13530-
FREQUENCY (GHz)
13530- Figure 10. Gain vs. Frequency at Various Supply Voltages Figure 13. Gain vs. Frequency at Various Supply Currents Rev. A | Page 6 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL SUPPLY CURRENT BY VDD ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCE During Power-Up During Power-Down TYPICAL APPLICATION CIRCUIT EVALUATION PRINTED CIRCUIT BOARD (PCB) BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE