Datasheet HMC7229LS6 (Analog Devices) - 9

制造商Analog Devices
描述GaAs, pHEMT, MMIC, 1 W, Power Amplifier with Power Detector, 37 GHz to 40 GHz
页数 / 页15 / 9 — Data Sheet. HMC7229LS6. 3 (d. 40GHz. 5.5V. 39GHz. 38GHz. 37GHz. FREQUENCY …
修订版E
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文件语言英语

Data Sheet. HMC7229LS6. 3 (d. 40GHz. 5.5V. 39GHz. 38GHz. 37GHz. FREQUENCY (GHz). POUT/TONE (dBm). c) B. 1950. POUT. GAIN. 1800. IDD. PAE. 1650. ), P B

Data Sheet HMC7229LS6 3 (d 40GHz 5.5V 39GHz 38GHz 37GHz FREQUENCY (GHz) POUT/TONE (dBm) c) B 1950 POUT GAIN 1800 IDD PAE 1650 ), P B

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文件文字版本

Data Sheet HMC7229LS6 42 70 60 40 ) 50 m c) B B 38 3 (d 3 (d IP IM 40 6V 40GHz 36 5.5V 39GHz 5V 38GHz 30 37GHz 34 20 37 38 39 40
022
10 12 14 16 18 20 22 24
-025 37-
FREQUENCY (GHz)
133
POUT/TONE (dBm)
13337 Figure 22. Output IP3 vs. Frequency for Various Supply Voltages Figure 25. Output IM3 at VDD = 5 V vs. POUT/Tone POUT/Tone = 20 dBm
70 70 60 60 50 c) 50 B c) B 3 (d 3 (d IM 40 IM 40 40GHz 40GHz 39GHz 39GHz 38GHz 30 38GHz 37GHz 30 37GHz 20 20 10 12 14 16 18 20 22 24
-023
10 12 14 16 18 20 22 24
-026
POUT/TONE (dBm)
13337
POUT/TONE (dBm)
13337 Figure 23. Output IM3 at VDD = 5.5 V vs. POUT/Tone Figure 26. Output IM3 at VDD = 6 V vs. POUT/Tone
35 1950 35 1950 POUT POUT 30 GAIN 1800 ) 30 GAIN 1800 IDD ) I (% DD PAE E (% PAE A 25 1650 E 25 1650 ), P B ), PA B 20 1500 ) (d A 20 1500 ) (d A IN m ( IN m ( GA A 15 1350 ), I DD 15 1350 ), G I DD m B m (d 10 1200 T (dB 10 1200 T OUP OUP 5 1050 5 1050 0 900 0 900 –15 –12 –9 –6 –3 0 3 6 9 12
024
–15 –12 –9 –6 –3 0 3 6 9 12
027 37-
INPUT POWER (dBm)
37- 133
INPUT POWER (dBm)
133 Figure 24. Power Compression (POUT, Gain, PAE, and IDD) at 38 GHz vs. Figure 27. Power Compression (POUT, Gain, PAE, and IDD) at 39 GHz vs. Input Power Input Power Rev. E | Page 9 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCE During Power-Up During Power-Down EVALUATION PRINTED CIRCUIT BOARD (PCB) TYPICAL APPLICATION CIRCUIT OUTLINE DIMENSIONS ORDERING GUIDE