Datasheet HMC637ALP5E (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC, 1 W Power Amplifier, 0.1 GHz to 6 GHz |
| 页数 / 页 | 11 / 10 — HMC637ALP5E. Data Sheet. EVALUATION PCB. LIST OF MATERIALS FOR PCB … |
| 修订版 | C |
| 文件格式/大小 | PDF / 269 Kb |
| 文件语言 | 英语 |
HMC637ALP5E. Data Sheet. EVALUATION PCB. LIST OF MATERIALS FOR PCB EV1HMC637ALP5E
该数据表的模型线
文件文字版本
link to page 10
HMC637ALP5E Data Sheet EVALUATION PCB
2 02 8- 1730 Figure 22. Evaluation Board PCB
LIST OF MATERIALS FOR PCB EV1HMC637ALP5E Table 5. Bill of Materials for Evaluation PCB
It is recommended that the circuit board used in the application
EV1HMC637ALP5E
follows proper RF circuit design techniques. Signal lines must
Item Description
have 50 Ω impedance while the package ground leads and J1, J2 SRI SMA connector package bottom are connected directly to the ground plane J3, J4 2 mm Molex header similar to that shown in Figure 22. Ensure that a sufficient C1, C2 100 pF capacitor, 0402 package number of via holes are used to connect the top and bottom C3 to C6 1000 pF capacitor, 0603 package ground planes. The evaluation board thermal design must also C7 to C9 4.7 μF capacitor, tantalum be considered and mounted to an appropriate heat sink. The U1 HMC637ALP5E evaluation circuit board shown is available from Analog PCB1 109765 evaluation PCB Devices, Inc. upon request. 1 Circuit board material: Rogers 4350. Rev. C | Page 10 of 11 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Applications Information Evaluation PCB List of Materials for PCB EV1HMC637ALP5E Outline Dimensions Ordering Guide
HMC637ALP5E Data Sheet EVALUATION PCB
2 02 8- 1730 Figure 22. Evaluation Board PCB
LIST OF MATERIALS FOR PCB EV1HMC637ALP5E Table 5. Bill of Materials for Evaluation PCB
It is recommended that the circuit board used in the application
EV1HMC637ALP5E
follows proper RF circuit design techniques. Signal lines must
Item Description
have 50 Ω impedance while the package ground leads and J1, J2 SRI SMA connector package bottom are connected directly to the ground plane J3, J4 2 mm Molex header similar to that shown in Figure 22. Ensure that a sufficient C1, C2 100 pF capacitor, 0402 package number of via holes are used to connect the top and bottom C3 to C6 1000 pF capacitor, 0603 package ground planes. The evaluation board thermal design must also C7 to C9 4.7 μF capacitor, tantalum be considered and mounted to an appropriate heat sink. The U1 HMC637ALP5E evaluation circuit board shown is available from Analog PCB1 109765 evaluation PCB Devices, Inc. upon request. 1 Circuit board material: Rogers 4350. Rev. C | Page 10 of 11 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Applications Information Evaluation PCB List of Materials for PCB EV1HMC637ALP5E Outline Dimensions Ordering Guide