Datasheet HMC637ASCPZ-EP (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC, 1 W Power Amplifier, 0.1 GHz to 6 GHz |
| 页数 / 页 | 9 / 4 — HMC637ASCPZ-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. … |
| 文件格式/大小 | PDF / 240 Kb |
| 文件语言 | 英语 |
HMC637ASCPZ-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating
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HMC637ASCPZ-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VDD 14 VDC (PCB) design and operating environment. Careful attention to VGG1 −3 VDC to 0 VDC PCB thermal design is required. VGG2 4 VDC to 7 VDC θJC is the junction to case thermal resistance. RF Input Power (RFIN), VDD = 12 VDC 25 dBm Channel Temperature 175°C
Table 3. Thermal Resistance
Continuous Power Dissipation, PDISS See Figure 2
Package Type θJC
1
Unit
Case Temperature (TCASE) = 85°C 8.6 W CP-32-29 10.5 °C/W TCASE = 105°C 6.7 W 1 Maximum Peak Reflow Temperature 260°C (MSL3 Thermal impedance simulated values are based on a JEDEC 1S0P thermal 1 Rating) test board. See JEDEC JESD-51. Storage Temperature Range −65°C to +150°C
POWER DERATING CURVES
Operating Temperature Range −55°C to +105°C Electrostatic Discharge (ESD) Sensitivity Figure 2 shows the maximum power dissipation vs. case Human Body Model (HBM) Class 1B temperature.
11
1 MSL3 stands for Moisture Sensitivity Level 3. Stresses at or above those listed under Absolute Maximum
) 10
Ratings may cause permanent damage to the product. This is a
(W N IO
stress rating only; functional operation of the product at these
9 T PA
or any other conditions above those indicated in the operational
8 ISSI
section of this specification is not implied. Operation beyond
D ER
the maximum operating conditions for extended periods may
7 W
affect product reliability.
M PO 6 MU XI MA 5 4 0 10 20 30 40 50 60 70 80 90 –60 –50 –40 –30 –20 –10 100 110 120 130
002
CASE TEMPERATURE (°C)
20371- Figure 2. Maximum Power Dissipation vs. Case Temperature
ESD CAUTION
Rev. 0 | Page 4 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE POWER DERATING CURVES ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
HMC637ASCPZ-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VDD 14 VDC (PCB) design and operating environment. Careful attention to VGG1 −3 VDC to 0 VDC PCB thermal design is required. VGG2 4 VDC to 7 VDC θJC is the junction to case thermal resistance. RF Input Power (RFIN), VDD = 12 VDC 25 dBm Channel Temperature 175°C
Table 3. Thermal Resistance
Continuous Power Dissipation, PDISS See Figure 2
Package Type θJC
1
Unit
Case Temperature (TCASE) = 85°C 8.6 W CP-32-29 10.5 °C/W TCASE = 105°C 6.7 W 1 Maximum Peak Reflow Temperature 260°C (MSL3 Thermal impedance simulated values are based on a JEDEC 1S0P thermal 1 Rating) test board. See JEDEC JESD-51. Storage Temperature Range −65°C to +150°C
POWER DERATING CURVES
Operating Temperature Range −55°C to +105°C Electrostatic Discharge (ESD) Sensitivity Figure 2 shows the maximum power dissipation vs. case Human Body Model (HBM) Class 1B temperature.
11
1 MSL3 stands for Moisture Sensitivity Level 3. Stresses at or above those listed under Absolute Maximum
) 10
Ratings may cause permanent damage to the product. This is a
(W N IO
stress rating only; functional operation of the product at these
9 T PA
or any other conditions above those indicated in the operational
8 ISSI
section of this specification is not implied. Operation beyond
D ER
the maximum operating conditions for extended periods may
7 W
affect product reliability.
M PO 6 MU XI MA 5 4 0 10 20 30 40 50 60 70 80 90 –60 –50 –40 –30 –20 –10 100 110 120 130
002
CASE TEMPERATURE (°C)
20371- Figure 2. Maximum Power Dissipation vs. Case Temperature
ESD CAUTION
Rev. 0 | Page 4 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE POWER DERATING CURVES ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE