Datasheet HMC590LP5E (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | GaAs pHEMT MMIC 1 WATT POWER AMPLIFIER, 6.0 - 9.5 GHz |
| 页数 / 页 | 8 / 5 — HMC590LP5E. GaAs pHEMT MMIC 1 WATT. POWER AMPLIFIER, 6.0 - 9.5 GHz. … |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
HMC590LP5E. GaAs pHEMT MMIC 1 WATT. POWER AMPLIFIER, 6.0 - 9.5 GHz. 32-Lead Lead Frame Chip Scale Package [LFCSP]
该数据表的模型线
文件文字版本
HMC590LP5E
v04.1219
GaAs pHEMT MMIC 1 WATT POWER AMPLIFIER, 6.0 - 9.5 GHz 32-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 5 x 5 mm Body and 0.90 mm Package Height (HCP-32-3) Dimensions shown in millimeters
T
DETAIL A (JEDEC 95)
M
5.10 0.30 5.00 SQ 0.25 PIN 1 4.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A)
S - S
25 32 24 1
R
0.50 BSC EXPOSED 3.80
IE
PAD 3.70 SQ 3.60
LIF P
17 8 16 9 0.45 0.20 MIN
M
TOP VIEW BOTTOM VIEW 0.40 0.35 3.50 REF 0.90 0.85 FOR PROPER CONNECTION OF
R A
0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND
E
FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. 0.08
W
SEATING PLANE 0.20 REF
O
PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4. 03-09-2017-B
32-Lead Lead Frame Chip Scale Package [LFCSP] R & P 5 mm × 5 mm and 0.90 mm Package Height A (HCP-32-3) E Dimensions shown in mil imeters LIN
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC590LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H590 XXXX HMC590LP5ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H590 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature P1dB vs. Temperature Psat vs. Temperature P1dB vs. Current Psat vs. Current Output IP3 vs. Temperature 7V @ 520 mA, Pin/Tone = -15 dBm Power Compression @ 8 GHz, 7V @ 820 mA Output IM3, 7V @ 820 mA Gain & Power vs. Supply Current @ 8 GHz Gain & Power vs. Supply Voltage @ 8 GHz Reverse Isolation vs. Temperature, 7V @ 820 mA Power Dissipation Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Package Information Pin Descriptions Application Circuit Evaluation PCB List of Materials for Evaluation PCB 115927
v04.1219
GaAs pHEMT MMIC 1 WATT POWER AMPLIFIER, 6.0 - 9.5 GHz 32-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 5 x 5 mm Body and 0.90 mm Package Height (HCP-32-3) Dimensions shown in millimeters
T
DETAIL A (JEDEC 95)
M
5.10 0.30 5.00 SQ 0.25 PIN 1 4.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A)
S - S
25 32 24 1
R
0.50 BSC EXPOSED 3.80
IE
PAD 3.70 SQ 3.60
LIF P
17 8 16 9 0.45 0.20 MIN
M
TOP VIEW BOTTOM VIEW 0.40 0.35 3.50 REF 0.90 0.85 FOR PROPER CONNECTION OF
R A
0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND
E
FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. 0.08
W
SEATING PLANE 0.20 REF
O
PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4. 03-09-2017-B
32-Lead Lead Frame Chip Scale Package [LFCSP] R & P 5 mm × 5 mm and 0.90 mm Package Height A (HCP-32-3) E Dimensions shown in mil imeters LIN
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC590LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H590 XXXX HMC590LP5ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H590 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature P1dB vs. Temperature Psat vs. Temperature P1dB vs. Current Psat vs. Current Output IP3 vs. Temperature 7V @ 520 mA, Pin/Tone = -15 dBm Power Compression @ 8 GHz, 7V @ 820 mA Output IM3, 7V @ 820 mA Gain & Power vs. Supply Current @ 8 GHz Gain & Power vs. Supply Voltage @ 8 GHz Reverse Isolation vs. Temperature, 7V @ 820 mA Power Dissipation Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Package Information Pin Descriptions Application Circuit Evaluation PCB List of Materials for Evaluation PCB 115927