Datasheet HMC459 (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz |
| 页数 / 页 | 8 / 4 — HMC459. GaAs PHEMT MMIC. POWER AMPLIFIER, DC - 18 GHz. Absolute Maximum … |
| 文件格式/大小 | PDF / 401 Kb |
| 文件语言 | 英语 |
HMC459. GaAs PHEMT MMIC. POWER AMPLIFIER, DC - 18 GHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd. Outline Drawing
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HMC459
v01.1007
GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +9 Vdc Vdd (V) Idd (mA) Gate Bias Voltage (Vgg1) -2 to 0 Vdc +7.5 292 Gate Bias Voltage (Vgg2) (Vdd -8) Vdc to Vdd +8.0 290 RF Input Power (RFIN)(Vdd = +8 Vdc) +16 dBm +8.5 288 3 Channel Temperature 175 °C Continuous Pdiss (T= 85 °C) 4.64 W (derate 51.5 mW/°C above 85 °C) Thermal Resistance IP 19.4 °C/W (channel to die bottom) H Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C S - C ELECTROSTATIC SENSITIVE DEVICE R OBSERVE HANDLING PRECAUTIONS IE IF
Outline Drawing
L P M R A E W O R & P A E IN L
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) GP-1 (Gel Pack) [2] 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND packaging dimensions. 7. BOND PAD METALIZATION: GOLD [2] For alternate packaging information contact Hittite Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
3 - 31
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v01.1007
GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +9 Vdc Vdd (V) Idd (mA) Gate Bias Voltage (Vgg1) -2 to 0 Vdc +7.5 292 Gate Bias Voltage (Vgg2) (Vdd -8) Vdc to Vdd +8.0 290 RF Input Power (RFIN)(Vdd = +8 Vdc) +16 dBm +8.5 288 3 Channel Temperature 175 °C Continuous Pdiss (T= 85 °C) 4.64 W (derate 51.5 mW/°C above 85 °C) Thermal Resistance IP 19.4 °C/W (channel to die bottom) H Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C S - C ELECTROSTATIC SENSITIVE DEVICE R OBSERVE HANDLING PRECAUTIONS IE IF
Outline Drawing
L P M R A E W O R & P A E IN L
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) GP-1 (Gel Pack) [2] 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND packaging dimensions. 7. BOND PAD METALIZATION: GOLD [2] For alternate packaging information contact Hittite Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
3 - 31
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D