Datasheet HMC409LP4E (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | GaAs InGaP HBT 1 WATT POWER AMPLIFIER, 3.3 - 3.8 GHz |
| 页数 / 页 | 8 / 5 — HMC409LP4E. GaAs InGaP HBT 1 WATT. POWER AMPLIFIER, 3.3 - 3.8 GHz. … |
| 文件格式/大小 | PDF / 1.1 Mb |
| 文件语言 | 英语 |
HMC409LP4E. GaAs InGaP HBT 1 WATT. POWER AMPLIFIER, 3.3 - 3.8 GHz. Typical Supply, Current vs. Supply. Absolute Maximum Ratings
该数据表的模型线
文件文字版本
HMC409LP4E
v04.1217
GaAs InGaP HBT 1 WATT POWER AMPLIFIER, 3.3 - 3.8 GHz Typical Supply, Current vs. Supply Absolute Maximum Ratings Voltage, Vcc1 = Vcc2 = Vpd
Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc Vs (Vdc) icq (mA) T Control Voltage (Vpd) +5.5 Vdc 4.75 516 m rf input power (rfin)(Vs = Vpd = +5Vdc) +10 dBm 5.0 615 s Junction Temperature 150 °C 5.25 721 Continuous pdiss (T = 85 °C) 3.74 w r - (derate 57.5 mw/°C above 85 °C) e Thermal resistance 17.4 °C/w (junction to ground paddle) w storage Temperature -65 to +150 °C eleCTrosTATiC sensiTiVe DeViCe o operating Temperature -40 to +85 °C oBserVe HAnDlinG preCAUTions p Class 1A, esD sensitivity (HBm) passed 250V
24-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 4 x 4 mm Body and 0.85 mm Package Height
r &
(CP-24-16) Dimensions shown in millimeters
A e
DETAIL A (JEDEC 95) 4.10 0.30
lin
4.00 SQ 0.25 PIN 1 3.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A) 19 24
s -
18 1
r
0.50 BSC 2.85 EXPOSED
ie
PAD 2.70 SQ 2.55
lif
13 6
p
0.50 12 7 TOP VIEW 0.20 MIN 0.40 BOTTOM VIEW
m
0.30 FOR PROPER CONNECTION OF
A
0.90 THE EXPOSED PAD, REFER TO 0.85 THE PIN CONFIGURATION AND 0.80 0.05 MAX FUNCTION DESCRIPTIONS 0.02 NOM SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.20 REF PKG-004926/PKG-004942 COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8. 05-25-2016-B
24-lead lead frame Chip scale package [lfCsp] 4 mm × 4 mm Body and 0.85 mm package Height (Cp-24-16) Dimensions shown in millimeters.
Package Information
part number package Body material lead finish msl rating package marking [2] HmC409lp4e roHs-compliant low stress injection molded plastic 100% matte sn msl3 [1] H409 XXXX [1] max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications EVM vs. Temperature @ 3.5 GHz OFDM 54 Mbps Signal Power Dissipation Gain, Power & Quiescent Supply Current vs. Vpd @ 3.5 GHz Noise Figure vs. Temperature Gain & Power vs. Supply Voltage Power Compression @ 3.5 GHz Output IP3 vs. Temperature Psat vs. Temperature P1dB vs. Temperature Power Down Isolation vs. Temperature Reverse Isolation vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Broadband Gain & Return Loss Absolute Maximum Ratings Typical Supply, Current vs. Supply Voltage, Vcc1 = Vcc2 = Vpd Outline Drawing Package Information Application Circuit Pin Descriptions Evaluation PCB List of Materials
v04.1217
GaAs InGaP HBT 1 WATT POWER AMPLIFIER, 3.3 - 3.8 GHz Typical Supply, Current vs. Supply Absolute Maximum Ratings Voltage, Vcc1 = Vcc2 = Vpd
Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc Vs (Vdc) icq (mA) T Control Voltage (Vpd) +5.5 Vdc 4.75 516 m rf input power (rfin)(Vs = Vpd = +5Vdc) +10 dBm 5.0 615 s Junction Temperature 150 °C 5.25 721 Continuous pdiss (T = 85 °C) 3.74 w r - (derate 57.5 mw/°C above 85 °C) e Thermal resistance 17.4 °C/w (junction to ground paddle) w storage Temperature -65 to +150 °C eleCTrosTATiC sensiTiVe DeViCe o operating Temperature -40 to +85 °C oBserVe HAnDlinG preCAUTions p Class 1A, esD sensitivity (HBm) passed 250V
24-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 4 x 4 mm Body and 0.85 mm Package Height
r &
(CP-24-16) Dimensions shown in millimeters
A e
DETAIL A (JEDEC 95) 4.10 0.30
lin
4.00 SQ 0.25 PIN 1 3.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A) 19 24
s -
18 1
r
0.50 BSC 2.85 EXPOSED
ie
PAD 2.70 SQ 2.55
lif
13 6
p
0.50 12 7 TOP VIEW 0.20 MIN 0.40 BOTTOM VIEW
m
0.30 FOR PROPER CONNECTION OF
A
0.90 THE EXPOSED PAD, REFER TO 0.85 THE PIN CONFIGURATION AND 0.80 0.05 MAX FUNCTION DESCRIPTIONS 0.02 NOM SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.20 REF PKG-004926/PKG-004942 COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8. 05-25-2016-B
24-lead lead frame Chip scale package [lfCsp] 4 mm × 4 mm Body and 0.85 mm package Height (Cp-24-16) Dimensions shown in millimeters.
Package Information
part number package Body material lead finish msl rating package marking [2] HmC409lp4e roHs-compliant low stress injection molded plastic 100% matte sn msl3 [1] H409 XXXX [1] max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications EVM vs. Temperature @ 3.5 GHz OFDM 54 Mbps Signal Power Dissipation Gain, Power & Quiescent Supply Current vs. Vpd @ 3.5 GHz Noise Figure vs. Temperature Gain & Power vs. Supply Voltage Power Compression @ 3.5 GHz Output IP3 vs. Temperature Psat vs. Temperature P1dB vs. Temperature Power Down Isolation vs. Temperature Reverse Isolation vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Broadband Gain & Return Loss Absolute Maximum Ratings Typical Supply, Current vs. Supply Voltage, Vcc1 = Vcc2 = Vpd Outline Drawing Package Information Application Circuit Pin Descriptions Evaluation PCB List of Materials