Datasheet HMC464LP5E (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | GaAs PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz |
| 页数 / 页 | 9 / 7 — HMC464LP5E. GAAS PHEMT MMIC. POWER AMPLIFIER, 2 - 20 GHz. 32-Lead Lead … |
| 文件格式/大小 | PDF / 1.2 Mb |
| 文件语言 | 英语 |
HMC464LP5E. GAAS PHEMT MMIC. POWER AMPLIFIER, 2 - 20 GHz. 32-Lead Lead Frame Chip Scale Package [LFCSP]
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HMC464LP5E
v04.0218
GAAS PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 x 5 mm Body and 0.85 mm Package Height Outline Drawing (HCP-32-1) Dimensions shown in millimeters DETAIL A
T
(JEDEC 95) 5.10 0.30
M
5.00 SQ 0.25
S
PIN 1 4.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A) 25 32 24 1
S -
0.50 BSC
R
EXPOSED 3.80 PAD 3.70 SQ
IE
3.60 17 8
LIF
16 9 0.45 0.20 MIN TOP VIEW BOTTOM VIEW
P
0.40 0.35 3.50 REF
M
0.90 0.85 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS COPLANARITY
R A
SECTION OF THIS DATA SHEET. 0.08 SEATING
E
PLANE 0.20 REF
W O
PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4. 03-09-2017-B
P 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.85 mm Package Height (HCP-32-1) R & Dimensions shown in mil imeters. A E
Package Information
LIN Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC464LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] H464 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7
Application Support: Phone: 1-800-ANALOG-D
v04.0218
GAAS PHEMT MMIC POWER AMPLIFIER, 2 - 20 GHz 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 x 5 mm Body and 0.85 mm Package Height Outline Drawing (HCP-32-1) Dimensions shown in millimeters DETAIL A
T
(JEDEC 95) 5.10 0.30
M
5.00 SQ 0.25
S
PIN 1 4.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A) 25 32 24 1
S -
0.50 BSC
R
EXPOSED 3.80 PAD 3.70 SQ
IE
3.60 17 8
LIF
16 9 0.45 0.20 MIN TOP VIEW BOTTOM VIEW
P
0.40 0.35 3.50 REF
M
0.90 0.85 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS COPLANARITY
R A
SECTION OF THIS DATA SHEET. 0.08 SEATING
E
PLANE 0.20 REF
W O
PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4. 03-09-2017-B
P 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.85 mm Package Height (HCP-32-1) R & Dimensions shown in mil imeters. A E
Package Information
LIN Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC464LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] H464 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7
Application Support: Phone: 1-800-ANALOG-D