Datasheet HMC981 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | ACTIVE BIAS CONTROLLER |
| 页数 / 页 | 18 / 10 — HMC981. ACTIVE BIAS CONTROLLER. Mounting & Bonding Techniques for … |
| 文件格式/大小 | PDF / 886 Kb |
| 文件语言 | 英语 |
HMC981. ACTIVE BIAS CONTROLLER. Mounting & Bonding Techniques for MMICs. Handling Precautions. Storage:. Cleanliness:
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HMC981
v00.0611
ACTIVE BIAS CONTROLLER Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC general Handling, Mounting , Bonding Note).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage:
All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective IP bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. H
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize S - C inductive pick-up. R
General Handling:
The chip may be handled by a vacuum collet or with a sharp pair of tweezers.
Mounting
LLE Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the O perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. R T N O S C IA B Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
10
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
v00.0611
ACTIVE BIAS CONTROLLER Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC general Handling, Mounting , Bonding Note).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage:
All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective IP bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. H
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize S - C inductive pick-up. R
General Handling:
The chip may be handled by a vacuum collet or with a sharp pair of tweezers.
Mounting
LLE Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the O perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. R T N O S C IA B Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
10
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D