Datasheet ADL6012 (Analog Devices) - 7

Data Sheet ADL6012 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ENBL 1 10 DCPL RFCM 2 9 VENV+ ADL6012 RFIN 3 8 VENV– TOP VIEW RFCM 4 (Not to Scale) 7 VOCM VPOS 5 6 OCOM NOTES 1. EXPOSED PAD. THE EXPOSED PAD (EPAD) ON THE UNDERSIDE OF THE DEVICE IS ALSO INTERNALLY CONNECTED TO GROUND AND REQUIRES GOOD THERMAL AND ELECTRICAL CONNECTION TO THE GROUND OF THE PRINTED CIRCUIT BOARD (PCB).
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CONNECT ALL GROUND PINS TO A LOW IMPEDANCE GROUND PLANE TOGETHER WITH THE EPAD.
16086- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1 ENBL Device Enable. Connect this pin to VPOS to enter an enabled state. Connect this pin to ground to enter a disabled state. This pin can also be driven from a 3 V logic output. 2, 4 RFCM RF Input Ground Pins. The RFCM pins are connected to the exposed pad (EPAD) at the bottom of the package. Connect the RFCM pins to the system ground using a low impedance ground plane together with the EPAD. 3 RFIN Signal Input. The RFIN pin is ac-coupled and has a nominal 100 Ω RF input impedance. 5 VPOS Supply Voltage. The operational range of this pin is from 3.15 V to 5.25 V. Decouple the power supply using suggested capacitor values of 100 pF and 0.1 µF and place these capacitors as close as possible to the VPOS pin. 6 OCOM Output Common. Connect this pin to a low impedance ground plane together with the EPAD. 7 VOCM Output Common-Mode Control Input. This pin is internally biased to VPOS/2, nominal. An acceptable range on this pin is 0.9 V to VPOS/2. 8, 9 VENV−, Envelope Detector Pseudo Differential Outputs. VENV− and VENV+ are the negative and positive outputs, respectively, VENV+ for the envelope detector output. A 50 Ω output impedance per pin forms a 100 Ω differential output impedance. These pins feature a 100 Ω differential load and a 2 pF to ground per pin drive capability. 10 DCPL Bypass Pin for an Internal Bias Node. Connect this pin through a 0.1 µF capacitor to ground for best common- mode noise rejection. EPAD Exposed Pad. The exposed pad (EPAD) on the underside of the device is also internally connected to ground and requires good thermal and electrical connection to the ground of the printed circuit board (PCB). Connect all ground pins to a low impedance ground plane together with the EPAD. Rev. 0 | Page 7 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS MEASUREMENT SETUPS THEORY OF OPERATION BASIC CONNECTIONS RF INPUT ENVELOPE OUTPUT INTERFACE COMMON-MODE VOLTAGE INTERFACE ENABLE INTERFACE DECOUPLING INTERFACE PCB LAYOUT RECOMMENDATIONS SYSTEM CALIBRATION AND MEASUREMENT ERROR APPLICATIONS INFORMATION EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE