Datasheet ADL6010S (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | FAST RESPONDING, 45 dB RANGE, 0.5 GHz TO 43.5 GHz ENVELOPE DETECTOR DIE |
| 页数 / 页 | 8 / 7 — ADL6010S. Table III – Life Test / Burn-in Delta Limits. Parameter. … |
| 修订版 | E |
| 文件格式/大小 | PDF / 243 Kb |
| 文件语言 | 英语 |
ADL6010S. Table III – Life Test / Burn-in Delta Limits. Parameter. Symbol. Condition. Delta. Unit. 5.0. Die Outline
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ADL6010S Table III – Life Test / Burn-in Delta Limits Parameter Symbol Condition Delta Unit
Dynamic Supply Current VPOS I RFin = +10dBm, 1GHz POS ±300 uA Frequency = 500MHz, ±0.2 V RFin = +10dBm Output Voltages Vout Frequency = 500MHz, ±0.08 V RFin = -10dBm
5.0 Die Outline Table IV – Pad Identification Pad Description Pad Size (mils)
1 RFCM 2.6 x 5.4 2 RFIN 2.6 x 6.2 3 RFCM 2.6 x 5.4 4 VPOS 2.6 x 2.6 5 VOUT 2.7 x 2.6 6 COMM 2.6 x 5.4 Notes: 1. All dimensions are in mils. 2. Die Thickness is 12 mils. 3. Bond metallization: Aluminum Copper 4. Overall Die Size +/- 2 mils. 5. No connection required for unlabeled bond pads. ASD0016585 Rev. E | Page 7 of 8 Document Outline AlCu (a) Qual Sample Size and Qual Acceptance Criteria – 10/0
Dynamic Supply Current VPOS I RFin = +10dBm, 1GHz POS ±300 uA Frequency = 500MHz, ±0.2 V RFin = +10dBm Output Voltages Vout Frequency = 500MHz, ±0.08 V RFin = -10dBm
5.0 Die Outline Table IV – Pad Identification Pad Description Pad Size (mils)
1 RFCM 2.6 x 5.4 2 RFIN 2.6 x 6.2 3 RFCM 2.6 x 5.4 4 VPOS 2.6 x 2.6 5 VOUT 2.7 x 2.6 6 COMM 2.6 x 5.4 Notes: 1. All dimensions are in mils. 2. Die Thickness is 12 mils. 3. Bond metallization: Aluminum Copper 4. Overall Die Size +/- 2 mils. 5. No connection required for unlabeled bond pads. ASD0016585 Rev. E | Page 7 of 8 Document Outline AlCu (a) Qual Sample Size and Qual Acceptance Criteria – 10/0