V 1700 V DSC2M1000170JI D@ 25˚C 5.3 A R 1.0 Ω Silicon Carbide Power MOSFETDS(on)C2MTM MOSFET Technology N-Channel Enhancement Mode FeaturesPackage • High blocking voltage with low RDS(on) • Easy to parallel and simple to drive • Low parasitic inductance • TAB Low impedance package Drain • Separate driver source pin • Ultra-low drain-gate capacitance • Halogen-Free, RoHS compliant • Fast intrinsic diode with low reverse recovery (Qrr) • Wide creepage (~7mm) between drain and source Drain(TAB)Benefits • Higher system efficiency 1 2 3 4 5 6 7G KS S S S S S • Smooth switching waveforms Gate • Reduced cooling requirements (Pin 1) • Minimum gate ringing DriverPower • Increased system reliability SourceSource(Pin 2)(Pin 3,4,5,6,7)Applications • Auxiliary power supplies Part NumberPackage • Switch Mode Power Supplies • High-voltage capacitive loads C2M1000170J TO-263-7 Maximum Ratings (T = 25 ˚C unless otherwise specified) C SymbolParameterValueUnitTest ConditionsNote VDSmax Drain - Source Voltage 1700 V VGS = 0 V, ID = 100 μA VGSmax Gate - Source Voltage -10/+25 V Absolute maximum values VGSop Gate - Source Voltage -5/+20 V Recommended operational values 5.3 V I GS = 20 V, TC = 25˚C Fig. 19 D Continuous Drain Current A 3.6 VGS = 20 V, TC = 100˚C ID(pulse) Pulsed Drain Current 6.0 A Pulse width tP limited by Tjmax Fig. 22 P Power Dissipation 78 W T =25˚C, T = 150 ˚C Fig. 20 D C J T , T Operating Junction and Storage Temperature -55 to J stg +150 ˚C T Solder Temperature 260 ˚C 1.6mm (0.063”) from case for 10s L 1 C2M1000170J Rev. B, 12-2017