Datasheet LM73100 (Texas Instruments) - 8

LM7310
SNOSDC0A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com 6.7 Switching Characteristics
The output rising slew rate is internally controlled and constant across the entire operating voltage range to ensure the turn on timing is not affected by the load conditions. The rising slew rate can be adjusted by adding capacitance from the dVdt pin to ground. As CdVdt is increased it will slow the rising slew rate (SR). See Slew Rate and Inrush Current Control (dVdt) section for more details. The Turn-Off Delay and Fall Time, however, are dependent on the RC time constant of the load capacitance (COUT) and Load Resistance (RL). The Switching Characteristics are only valid for the power-up sequence where the supply is available in steady state condition and the load voltage is completely discharged before the device is enabled.Typical Values are taken at TJ = 25°C unless specifically noted otherwise. RL = 100 Ω, COUT = 1 µF
C PARAMETER V dVdt = IN CdVdt = Open CdVdt = 1800 pF UNIT 3300 pF
2.7 V 12.14 0.87 0.5 SRON Output Rising slew rate 12 V 28.1 1.09 0.61 V/ms 23 V 44.78 1.25 0.71 2.7 V 0.09 0.6 0.97 tD,ON Turn on delay 12 V 0.1 1.32 2.35 ms 23 V 0.11 1.99 3.69 2.7 V 0.17 2.51 4.33 tR Rise time 12 V 0.35 8.1 15.37 ms 23 V 0.40 14.4 25.89 2.7 V 0.27 3.11 5.31 tON Turn on time 12 V 0.45 10.08 17.72 ms 23 V 0.50 16.41 29.57 2.7 V 64.44 64.44 64.44 tD,OFF Turn off delay 12 V 25.32 25.32 25.32 µs 23 V 23.02 23.02 23.02 VEN/UVLO
EN/UVLO
VUVLO(R) VUVLO(F) 0 tON tD,OFF VIN SR 90% ON
OUT
0V 10% tR tF tD,ON
Time Figure 6-1. LM73100 Switching Times
8 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: LM7310 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Timing Requirements 6.7 Switching Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Input Reverse Polarity Protection 7.3.2 Undervoltage Protection (UVLO & UVP) 7.3.3 Overvoltage Lockout (OVLO) 7.3.4 Inrush Current control and Fast-trip 7.3.4.1 Slew Rate (dVdt) and Inrush Current Control 7.3.4.2 Fast-Trip During Steady State 7.3.5 Analog Load Current Monitor Output 7.3.6 Reverse Current Protection 7.3.7 Overtemperature Protection (OTP) 7.3.8 Fault Response 7.3.9 Power Good Indication (PG) 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Single Device, Self-Controlled 8.2.1 Typical Application 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Setting Undervoltage and Overvoltage Thresholds 8.2.1.2.2 Setting Output Voltage Rise Time (tR) 8.2.1.2.3 Setting Power Good Assertion Threshold 8.2.1.2.4 Setting Analog Current Monitor Voltage (IMON) Range 8.2.1.3 Application Curves 8.3 Active ORing 8.4 Priority Power MUXing 8.5 USB PD Port Protection 8.6 Parallel Operation 9 Power Supply Recommendations 9.1 Transient Protection 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates 11.3 Support Resources 11.4 Trademarks 11.5 Electrostatic Discharge Caution 11.6 Glossary 12 Mechanical, Packaging, and Orderable Information