Datasheet L6981 (STMicroelectronics) - 5
| 制造商 | STMicroelectronics |
| 描述 | 38 V, 1.5 A synchronous step-down converter with low quiescent current |
| 页数 / 页 | 49 / 5 — L6981. Absolute maximum ratings. Table 3. Absolute maximum ratings. … |
| 文件格式/大小 | PDF / 3.5 Mb |
| 文件语言 | 英语 |
L6981. Absolute maximum ratings. Table 3. Absolute maximum ratings. Symbol. Parameter. Min. Max. Unit. Table 4. ESD performance
该数据表的模型线
文件文字版本
L6981 Absolute maximum ratings 4 Absolute maximum ratings
Stressing the device above the ratings listed in the table below may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Table 3. Absolute maximum ratings Symbol Parameter Min. Max. Unit
VIN Maximum pin voltage -0.3 42 V PGND to AGND Maximum pin voltage -0.3 0.3 V BOOT Maximum pin voltage SW – 0.3 SW + 4 V VCC Maximum pin voltage -0.3 Min. (VIN + 0.3 V; 4 V) V VOUT/FB Maximum pin voltage -0.3 8 V EN Maximum pin voltage -0.3 VIN + 0.3 V -0.85 VIN + 0.3 V SW Maximum pin voltage -3.9 for 0.5 ns VIN + 0.3 V IHS, ILS High-side / Low-side RMS switch current 1.5 A TJ Operating temperature range -40 150 °C TSTG Storage temperature range -65 150 °C TLEAD Lead temperature (soldering 10 sec.) 260 °C Note: All values are referred to AGND unless otherwise specified.
Table 4. ESD performance Symbol Parameter Test conditions Value Unit
HBM 2 kV ESD ESD Protection voltage CDM pins 500 V
Table 5. Thermal data Symbol Parameter Value Unit
R Thermal resistance junction ambient (device soldered thJA 65 °C/W on the STMicroelectronics demonstration board)
DS13554
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Rev 1 page 5/49
Document Outline 1 Diagram 2 Pin configuration 3 Typical application circuit 4 Absolute maximum ratings 5 Electrical characteristics 6 Functional description 6.1 Enable 6.2 Soft-start 6.3 Undervoltage lockout 6.4 Light-load operation 6.4.1 Low consumption mode (LCM) 6.4.2 Low noise mode (LNM) 6.4.3 Efficiency for Low consumption mode and Low noise mode part number 6.4.4 Load regulation for low consumption mode and low noise mode part number 6.5 Overvoltage protection 6.5.1 Low consumption mode part number 6.5.2 Low noise mode part number 6.6 Overcurrent protection 6.7 Thermal shutdown 7 Closing the loop 7.1 GCO(s) control to output transfer function 7.2 Error amplifier compensation network 7.3 Voltage divider 8 Design of the power components 8.1 Programmable power up threshold 8.2 External synchronization (only available for Low Noise Mode) 8.3 Output voltage adjustment 8.4 Design of the power components 8.4.1 Input capacitor selection 8.4.2 Inductor selection 8.4.3 Output capacitor selection 9 Application board 10 Efficiency curves 11 Thermal dissipation 12 Package information 12.1 SO 8L package information 13 Ordering information Revision history
Stressing the device above the ratings listed in the table below may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Table 3. Absolute maximum ratings Symbol Parameter Min. Max. Unit
VIN Maximum pin voltage -0.3 42 V PGND to AGND Maximum pin voltage -0.3 0.3 V BOOT Maximum pin voltage SW – 0.3 SW + 4 V VCC Maximum pin voltage -0.3 Min. (VIN + 0.3 V; 4 V) V VOUT/FB Maximum pin voltage -0.3 8 V EN Maximum pin voltage -0.3 VIN + 0.3 V -0.85 VIN + 0.3 V SW Maximum pin voltage -3.9 for 0.5 ns VIN + 0.3 V IHS, ILS High-side / Low-side RMS switch current 1.5 A TJ Operating temperature range -40 150 °C TSTG Storage temperature range -65 150 °C TLEAD Lead temperature (soldering 10 sec.) 260 °C Note: All values are referred to AGND unless otherwise specified.
Table 4. ESD performance Symbol Parameter Test conditions Value Unit
HBM 2 kV ESD ESD Protection voltage CDM pins 500 V
Table 5. Thermal data Symbol Parameter Value Unit
R Thermal resistance junction ambient (device soldered thJA 65 °C/W on the STMicroelectronics demonstration board)
DS13554
-
Rev 1 page 5/49
Document Outline 1 Diagram 2 Pin configuration 3 Typical application circuit 4 Absolute maximum ratings 5 Electrical characteristics 6 Functional description 6.1 Enable 6.2 Soft-start 6.3 Undervoltage lockout 6.4 Light-load operation 6.4.1 Low consumption mode (LCM) 6.4.2 Low noise mode (LNM) 6.4.3 Efficiency for Low consumption mode and Low noise mode part number 6.4.4 Load regulation for low consumption mode and low noise mode part number 6.5 Overvoltage protection 6.5.1 Low consumption mode part number 6.5.2 Low noise mode part number 6.6 Overcurrent protection 6.7 Thermal shutdown 7 Closing the loop 7.1 GCO(s) control to output transfer function 7.2 Error amplifier compensation network 7.3 Voltage divider 8 Design of the power components 8.1 Programmable power up threshold 8.2 External synchronization (only available for Low Noise Mode) 8.3 Output voltage adjustment 8.4 Design of the power components 8.4.1 Input capacitor selection 8.4.2 Inductor selection 8.4.3 Output capacitor selection 9 Application board 10 Efficiency curves 11 Thermal dissipation 12 Package information 12.1 SO 8L package information 13 Ordering information Revision history