Datasheet MAX6511, MAX6512, MAX6513 (Maxim) - 4

Low-Cost, Remote SOT Temperature Switches Pin Description PIN MAX6511 NAME FUNCTION MAX6513 MAX6512
Power-Supply Input, +3.0V to +5.5V. Bypass V 1 1 V DD to GND with a 0.1µF DD capacitor. 2 2 GND Ground 3 3 HYST Hysteresis Selection. Hysteresis is 10°C for HYST = VDD, 5°C for HYST = GND. CMOS Active-Low Output (MAX6511) or Open-Drain Active-Low Output (MAX6512). TOVER goes low when the temperature exceeds the factory- 4 — TOVER programmed temperature threshold. This pin can only sink current in the MAX6512. CMOS Active-High Output (MAX6513). TOVER goes high when the temperature — 4 TOVER exceeds the factory-programmed temperature threshold. This pin connects to the negative (cathode) terminal of the external P-N sense 5 5 DXN junction. DXN must be connected to GND. This pin connects to the positive (anode) terminal of the external P-N sense 6 6 DXP junction.
Detailed Description
The MAX6512 has an active-low, open-drain output struc-
MAX6511/MAX6512/MAX6513
ture that can only sink current. The MAX6511 has an active- The MAX6511/MAX6512/MAX6513 fully integrated tem- low CMOS output structure, and the MAX6513 has an perature switches incorporate a precision bandgap ref- active-high CMOS output. erence, a conversion block, a current source, and a comparator (Figure 1). These devices use an external The MAX6511/MAX6512/MAX6513 are available with P-N junction as the temperature-sensing element. They preset temperature thresholds from +45°C to +125°C in steer bias currents through the external diode, measure 10°C increments. the forward voltages, and compute the temperature using a precision chopper stabilized amplifier. Resistance values of less than 100Ω in series with the external sense junction will result in trip-point errors <1°C. The MAX6511/MAX6512/MAX6513 provide noise immunity by integration and oversampling of the diode DXP TEMPERATURE voltage, but good design practice includes routing the DXN CONVERSION DXP and DXN lines away from noise sources, such as COMPAR- LATCH TOVER ATOR high-speed digital lines, switching regulators, induc- tors, and transformers. The DXP and DXN traces should be paired together and surrounded by ground plane whenever possible. VOLTAGE BANDGAP REFERENCE In applications where the temperature changes rapidly, the measured temperature will be approximately equal to the average value of the temperature during the measurement period. Figure 1. Functional Block Diagram
4 _______________________________________________________________________________________