Datasheet TL331, TL331B, TL391B (Texas Instruments) - 5

制造商Texas Instruments
描述Single Comparators
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TL331, TL331B, TL391B. www.ti.com. 6.3 ESD Ratings, TL331 and TL331K. VALUE. UNIT. 6.4 ESD Ratings, TL331B and TL391B

TL331, TL331B, TL391B www.ti.com 6.3 ESD Ratings, TL331 and TL331K VALUE UNIT 6.4 ESD Ratings, TL331B and TL391B

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TL331, TL331B, TL391B www.ti.com
SLVS238J – AUGUST 1999 – REVISED NOVEMBER 2020
6.3 ESD Ratings, TL331 and TL331K VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.4 ESD Ratings, TL331B and TL391B VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.5 Recommended Operating Conditions, TL331 and TL331K
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 2 36 V TJ Junction temperature, TL331 –40 85 °C TJ Junction temperature, TL331K –40 105 °C
6.6 Recommended Operating Conditions, TL331B and TL391B
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 2 36 V TJ Junction temperature –40 125 °C
6.7 Thermal Information TL331, TL331B, TL331K TL391B THERMAL METRIC(1) UNIT DBV (SOT-23) DBV (SOT-23) 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 218.3 211.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 87.3 133.6 °C/W RθJB Junction-to-board thermal resistance 44.9 79.9 °C/W ψJT Junction-to-top characterization parameter 4.3 56.4 °C/W ψJB Junction-to-board characterization parameter 44.1 79.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TL331 TL331B TL391B Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions Pin Functions 6 Specifications 6.1 Absolute Maximum Ratings, TL331 and TL331K 6.2 Absolute Maximum Ratings, TL331B and TL391B 6.3 ESD Ratings, TL331 and TL331K 6.4 ESD Ratings, TL331B and TL391B 6.5 Recommended Operating Conditions, TL331 and TL331K 6.6 Recommended Operating Conditions, TL331B and TL391B 6.7 Thermal Information 6.8 Electrical Characteristics, TL331B and TL391B 6.9 Switching Characteristics, TL331B and TL391B 6.10 Electrical Characteristics, TL331 and TL331K 6.11 Switching Characteristics, TL331 and TL331K 6.12 Typical Characteristics, TL331 and TL331K 6.13 Typical Characteristics, TL331B and TL391B 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.4 Device Functional Modes 7.4.1 Voltage Comparison 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.2.2.1 Input Voltage Range 8.2.2.2 Minimum Overdrive Voltage 8.2.2.3 Output and Drive Current 8.2.2.4 TL331B & TL391B ESD Protection 8.2.2.5 Response Time 8.2.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates 11.3 Support Resources 11.4 Trademarks 11.5 Electrostatic Discharge Caution 11.6 Glossary 12 Mechanical, Packaging, and Orderable Information