Datasheet ESDCAN03-2BM3Y (STMicroelectronics) - 10
| 制造商 | STMicroelectronics |
| 描述 | Automotive dual-line TVS in DFN for CAN bus |
| 页数 / 页 | 15 / 10 — ESDCAN03-2BM3Y. Packing information. Figure 21. Tape outline. Table 4. … |
| 文件格式/大小 | PDF / 1.4 Mb |
| 文件语言 | 英语 |
ESDCAN03-2BM3Y. Packing information. Figure 21. Tape outline. Table 4. Tape dimension values. Dimensions. Ref. Millimeters. Min. Typ. Max
该数据表的模型线
文件文字版本
ESDCAN03-2BM3Y Packing information Figure 21. Tape outline Table 4. Tape dimension values Dimensions Ref. Millimeters Min. Typ. Max.
D0 1.50 1.55 1.60 D1 0.55 0.60 0.65 F 3.45 3.50 3.55 K0 0.67 0.70 0.73 P0 3.90 4.00 4.10 P1 3.90 4.00 4.10 P2 1.95 2.00 2.05 W 7.90 8.00 8.10
DS13559
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Rev 2 page 10/15
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history
D0 1.50 1.55 1.60 D1 0.55 0.60 0.65 F 3.45 3.50 3.55 K0 0.67 0.70 0.73 P0 3.90 4.00 4.10 P1 3.90 4.00 4.10 P2 1.95 2.00 2.05 W 7.90 8.00 8.10
DS13559
-
Rev 2 page 10/15
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history