Datasheet ADN4624 (Analog Devices) - 8

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ADN4624 ABSOLUTE MAXIMUM RATINGS Table 9. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to PCB design and operation VDD1 to GND1/VDD2 to GND2 −0.3 V to +2 V environment. Close attention to PCB thermal design is required. Input Voltage REFRESH1 to GND1/REFRESH2 −0.3 V to +2 V to GND θ 2 JA is the natural convection junction to ambient thermal resistance Input Voltage (D measured in a one cubic foot sealed enclosure. INx+, DINx−) to GNDx on the −0.3 V to +4 V Same Side
Table 11. Thermal Resistance
Output Voltage (DOUTx+, DOUTx−) to GNDx on the −0.3 V to +2 V Same Side
Package Type1 θJA Unit
Short-Circuit Duration (D RN-28-1 43.45 °C/W OUTx+, DOUTx−) to GNDx Continuous on the Same Side 1 Test Condition 1: thermal impedance simulated with 4-layer standard JEDEC Operating Temperature Range −40°C to +125°C PCB. Storage Temperature Range −65°C to +150°C Junction Temperature (TJ Maximum) 150°C
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Power Dissipation (TJ maximum − TA)/θJA The following ESD information is provided for handling of ESD-sen- Stresses at or above those listed under Absolute Maximum Ratings sitive devices in an ESD protected area only. may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. conditions above those indicated in the operational section of this International electrotechnical commission (IEC) electromagnetic specification is not implied. Operation beyond the maximum operat- compatibility: Part 4-2 (IEC) per IEC 61000-4-2. ing conditions for extended periods may affect product reliability.
Table 10. Maximum Continuous Working Voltage1, RN-28-1 W ide Body with ESD Ratings for ADN4624 Finer Pitch [SOIC_W_FP] Package Table 12. ADN4624, 28-Lead SOIC_W_FP Parameter Rating Constraint ESD Model Withstand Threshold (V) Class
AC Voltage HBM1 ±4000 3A Bipolar Waveform IEC2 ±8000 (contact discharge) Level 4 Basic Insulation 650 V rms Basic insulation rating per IEC60747-17. Accumulative failure 1 All pins to respective GNDx, 1.5 kΩ, 100 pF. rate over lifetime (FROL) ≤ 1000 ppm 2 LVDS pins to isolated GNDx across isolation barrier. at 20 years. Reinforced Insulation 600 V rms Reinforced insulation rating per
ESD CAUTION
IEC60747-17. Accumulative FROL ≤ 1 ppm at 26 years.
ESD (electrostatic discharge) sensitive device
. Charged devi- Unipolar Waveform ces and circuit boards can discharge without detection. Although Basic Insulation 1782 V this product features patented or proprietary protection circuitry, PEAK Rating limited by AC bipolar waveform accumulative FROL ≤ damage may occur on devices subjected to high energy ESD. 1000 ppm at 20 years . Therefore, proper ESD precautions should be taken to avoid Reinforced Insulation 1330 V performance degradation or loss of functionality. PEAK Rating limited by package creepage per IEC 60664-1 in Pollution Degree 2 environment. DC Voltage Basic Insulation 1660 VDC Rating limited by package creepage per IEC 60664-1 in Pollution Degree 2 environment. Reinforced Insulation 830 VDC Rating limited by package creepage per IEC 60664-1 in Pollution Degree 2 environment. 1 Maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier in a Pollution Degree 2 environment. See the Insulation Lifetime section for more details.
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Document Outline Features Applications Functional Block Diagram General Description Specifications Receiver Input Threshold Test Voltages Timing Specifications Insulation and Safety Related Specifications Package Characteristics Regulatory Information DIN V VDE V 0884-11 (VDE V 0884-11) Insulation Characteristics (Pending) Recommended Operating Conditions Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for ADN4624 ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits and Switching Characteristics Theory of Operation Isolation and Refresh Truth Table Applications Information PCB Layout Application Examples Magnetic Field Immunity Insulation Lifetime Surface Tracking Insulation Wear Out Calculation and Use of Parameters Example Outline Dimensions Ordering Guide Evaluation Boards