Datasheet MAX38889 (Maxim) - 2
| 制造商 | Maxim |
| 描述 | 2.5V–5.5V, 3A Reversible Buck/Boost Regulator for Backup Applications |
| 页数 / 页 | 17 / 2 — Absolute Maximum Ratings. Package Information TQFN. THERMAL RESISTANCE, … |
| 文件格式/大小 | PDF / 588 Kb |
| 文件语言 | 英语 |
Absolute Maximum Ratings. Package Information TQFN. THERMAL RESISTANCE, FOUR-LAYER BOARD
该数据表的模型线
文件文字版本
MAX38889 2.5V to 5.5V, 3A Reversible Buck/Boost Regulator for Backup Applications
Absolute Maximum Ratings
CAP, ENB, ENC to GND .. -0.3V to +6V Operating Temperature Range ... -40°C to +125°C SYS, BKB, RDY to GND .. -0.3V to +6V Storage Temperature Range ... -65°C to +150°C FBCH, FBCR to GND .. -0.3V to CAP + 0.3V Maximum Junction Temperature .. +150°C FBS, ISET to GND .. -0.3V to SYS + 0.3V Lead Temperature (soldering, 10 seconds) ... +300°C PGND to GND ... -0.3V to +0.3V Soldering Temperature (reflow)... +260°C Continuous Power Dissipation (TA = +70°C, TQFN, LX RMS Current .. ±5.0ARMS derate 23.1mW/°C above +70°C) .. 1847.6mW Output Short-Circuit Duration .. Continuous Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information TQFN
Package Code T1633+5C Outline Number 21-0136 Land Pattern Number 90-0032
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 43.3°C/W Junction to Case (θJC) 4°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal- tutorial. www.maximintegrated.com Maxim Integrated | 2 Document Outline Product Highlights Key Applications Simplified Application Diagram Pin Configuration Absolute Maximum Ratings Package Information Electrical Characteristics Typical Operating Characteristics Pin Configuration Pin Descriptions Functional Diagram Detailed Description Application Circuits Supercapacitor Voltage Configuration System Voltage Configuration Charge/Discharge Current Configuration Charging Backup Applications Information Capacitor Selection Supercapacitor Selection Inductor Selection Status Flags BKB Flag RDY Flag Enabling the Device Charger Enable Input (ENC) Backup Enable Input (ENB) PCB Layout Guidelines Ordering Information
Absolute Maximum Ratings
CAP, ENB, ENC to GND .. -0.3V to +6V Operating Temperature Range ... -40°C to +125°C SYS, BKB, RDY to GND .. -0.3V to +6V Storage Temperature Range ... -65°C to +150°C FBCH, FBCR to GND .. -0.3V to CAP + 0.3V Maximum Junction Temperature .. +150°C FBS, ISET to GND .. -0.3V to SYS + 0.3V Lead Temperature (soldering, 10 seconds) ... +300°C PGND to GND ... -0.3V to +0.3V Soldering Temperature (reflow)... +260°C Continuous Power Dissipation (TA = +70°C, TQFN, LX RMS Current .. ±5.0ARMS derate 23.1mW/°C above +70°C) .. 1847.6mW Output Short-Circuit Duration .. Continuous Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information TQFN
Package Code T1633+5C Outline Number 21-0136 Land Pattern Number 90-0032
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 43.3°C/W Junction to Case (θJC) 4°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal- tutorial. www.maximintegrated.com Maxim Integrated | 2 Document Outline Product Highlights Key Applications Simplified Application Diagram Pin Configuration Absolute Maximum Ratings Package Information Electrical Characteristics Typical Operating Characteristics Pin Configuration Pin Descriptions Functional Diagram Detailed Description Application Circuits Supercapacitor Voltage Configuration System Voltage Configuration Charge/Discharge Current Configuration Charging Backup Applications Information Capacitor Selection Supercapacitor Selection Inductor Selection Status Flags BKB Flag RDY Flag Enabling the Device Charger Enable Input (ENC) Backup Enable Input (ENB) PCB Layout Guidelines Ordering Information