Datasheet TMP114 (Texas Instruments) - 4

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TMP114
SNIS214 – JUNE 2021
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply, VDD -0.3 2.1 V Input voltage SCL, SDA -0.3 2.1 V Output sink current SDA 15 mA Junction temperature, TJ -55 150 °C Storage temperature, Tstg -65 155 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
AD
reliability.
V 6.2 ESD Ratings A VALUE UNIT NCE INFO
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions R
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT MA
Supply voltage VDD 1.08 1.98 V I/O Voltage SCL, SDA 0 1.98 V
TION
IOL SDA 0 2 mA Operating free-air temperature, TA –40 125 °C
6.4 Thermal Information TMP114 THERMAL METRIC
(1)
YMT UNIT 4 PINS
RθJA Junction-to-ambient thermal resistance 168.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.0 °C/W RθJB Junction-to-board thermal resistance 47.3 °C/W ΨJT Junction-to-top characterization parameter 0.6 °C/W ΨJB Junction-to-board characterization parameter 47.3 °C/W RθJC(bot) Junction-to-case (bot) thermal resistance – °C/W MT Thermal mass TBD mJ/°C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TMP114 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 I2C Interface Timing 6.7 Two-Wire Timing Diagram 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Cyclic Redundancy Check (CRC) 7.3.2 Temperature Limits 7.3.3 Slew Rate Warning 7.3.4 NIST Traceability 7.4 Device Functional Modes 7.4.1 Continuous Conversion Mode 7.4.2 Shutdown Mode 7.4.2.1 One-Shot Temperature Conversions 7.5 Programming 7.5.1 Temperature Data Format 7.5.2 I2C and SMBus Interface 7.5.3 Device Address 7.5.4 Bus Transactions 7.5.4.1 Auto-Increment 7.5.4.2 Writes 7.5.4.2.1 CRC Enabled Writes 7.5.4.3 Reads 7.5.4.3.1 CRC Enabled Reads 7.5.4.4 General Call Reset Function 7.5.4.5 Time-Out Function 7.5.4.6 I2C in I3C Mixed Fast Mode 7.5.4.7 Cyclic Redundancy Check Implementation 7.6 Register Map 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates 11.2 Support Resources 11.3 Trademarks 11.4 Electrostatic Discharge Caution 11.5 Glossary 12 Mechanical, Packaging, and Orderable Information 12.1 Tape and Reel Information