Datasheet GD32E503xx (GigaDevice) - 6
| 制造商 | GigaDevice |
| 描述 | Arm Cortex-M33 32-bit MCU |
| 页数 / 页 | 98 / 6 — List of Tables. Table 2-1. GD32E503xx devices features and peripheral … |
| 文件格式/大小 | PDF / 2.9 Mb |
| 文件语言 | 英语 |
List of Tables. Table 2-1. GD32E503xx devices features and peripheral list .. 8. Table 2-2. GD32E503xx memory map .. 13
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List of Tables Table 2-1. GD32E503xx devices features and peripheral list .. 8 Table 2-2. GD32E503xx memory map .. 13 Table 2-3. GD32E503Zx LQFP144 pin definitions ... 18 Table 2-4. GD32E503Vx LQFP100 pin definitions .. 28 Table 2-5. GD32E503Rx LQFP64 pin definitions .. 35 Table 2-6. GD32E503Cx LQFP48 pin definitions .. 40 Table 4-1. Absolute maximum ratings (1)(4) .. 54 Table 4-2. DC operating conditions ... 54 Table 4-3. Clock frequency (1) ... 55 Table 4-4. Operating conditions at Power up/ Power down (1) .. 55 Table 4-5. Start-up timings of Operating conditions (1)(2)(3) .. 55 Table 4-6. Power saving mode wakeup timings characteristics (1)(2) .. 56 Table 4-7. Power consumption characteristics (2)(3)(4)(5) ... 56 Table 4-8. Peripheral current consumption characteristics (1) .. 63 Table 4-9. EMS characteristics (1) ... 65 Table 4-10. Power supply supervisor characteristics.. 65 Table 4-11. ESD characteristics (1) ... 66 Table 4-12. Static latch-up characteristics (1) .. 66 Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics 67 Table 4-14. High speed external clock characteristics (HXTAL in bypass mode) .. 67 Table 4-15. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics . 67 Table 4-16. Low speed external user clock characteristics (LXTAL in bypass mode) ... 68 Table 4-17. High speed internal clock (IRC8M) characteristics .. 69 Table 4-18. Low speed internal clock (IRC40K) characteristics ... 69 Table 4-19. High speed internal clock (IRC48M) characteristics .. 70 Table 4-20. PLL characteristics .. 70 Table 4-21. PLL1 characteristics .. 71 Table 4-22. PLL2 characteristics .. 71 Table 4-23. PLLUSB characteristics .. 71 Table 4-24. Flash memory characteristics .. 72 Table 4-25. NRST pin characteristics .. 72 Table 4-26. I/O port DC characteristics (1)(3) ... 73 Table 4-27. I/O port AC characteristics (1)(2) ... 74 Table 4-28. Temperature sensor characteristics (1) .. 74 Table 4-29. ADC characteristics ... 75 Table 4-30. ADC RAIN max for fADC = 35 MHz .. 75 Table 4-31. ADC dynamic accuracy at fADC = 14 MHz (1) ... 76 Table 4-32. ADC dynamic accuracy at fADC = 35 MHz (1) ... 76 Table 4-33. ADC static accuracy at fADC = 14 MHz (1) .. 76 Table 4-34. DAC characteristics ... 77
5 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E503Zx LQFP144 pin definitions 2.6.2. GD32E503Vx LQFP100 pin definitions 2.6.3. GD32E503Rx LQFP64 pin definitions 2.6.4. GD32E503Cx LQFP48 pin definitions 3. Functional description 3.1. Arm® Cortex®-M33 core 3.2. Embedded memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal Serial Bus full-speed device interface (USBD) 3.17. Controller area network (CAN) 3.18. External memory controller (EXMC) 3.19. Secure digital input/output interface (SDIO) 3.20. Super High-Resolution Timer (SHRTIMER) 3.21. Serial/Quad Parallel Interface (SQPI) 3.22. Debug mode 3.23. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. Temperature sensor characteristics 4.14. ADC characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. CAN characteristics 4.21. USBD characteristics 4.22. SDIO characteristics 4.23. EXMC characteristics 4.24. Serial/Quad Parallel Interface (SQPI) characteristics 4.25. Super High-Resolution Timer (SHRTIMER) characteristics 4.26. TIMER characteristics 4.27. WDGT characteristics 4.28. Parameter condition 5. Package information 5.1. LQFP144 package outline dimensions 5.2. LQFP100 package outline dimensions 5.3. LQFP64 package outline dimensions 5.4. LQFP48 package outline dimensions 6. Ordering information 7. Revision history
List of Tables Table 2-1. GD32E503xx devices features and peripheral list .. 8 Table 2-2. GD32E503xx memory map .. 13 Table 2-3. GD32E503Zx LQFP144 pin definitions ... 18 Table 2-4. GD32E503Vx LQFP100 pin definitions .. 28 Table 2-5. GD32E503Rx LQFP64 pin definitions .. 35 Table 2-6. GD32E503Cx LQFP48 pin definitions .. 40 Table 4-1. Absolute maximum ratings (1)(4) .. 54 Table 4-2. DC operating conditions ... 54 Table 4-3. Clock frequency (1) ... 55 Table 4-4. Operating conditions at Power up/ Power down (1) .. 55 Table 4-5. Start-up timings of Operating conditions (1)(2)(3) .. 55 Table 4-6. Power saving mode wakeup timings characteristics (1)(2) .. 56 Table 4-7. Power consumption characteristics (2)(3)(4)(5) ... 56 Table 4-8. Peripheral current consumption characteristics (1) .. 63 Table 4-9. EMS characteristics (1) ... 65 Table 4-10. Power supply supervisor characteristics.. 65 Table 4-11. ESD characteristics (1) ... 66 Table 4-12. Static latch-up characteristics (1) .. 66 Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics 67 Table 4-14. High speed external clock characteristics (HXTAL in bypass mode) .. 67 Table 4-15. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics . 67 Table 4-16. Low speed external user clock characteristics (LXTAL in bypass mode) ... 68 Table 4-17. High speed internal clock (IRC8M) characteristics .. 69 Table 4-18. Low speed internal clock (IRC40K) characteristics ... 69 Table 4-19. High speed internal clock (IRC48M) characteristics .. 70 Table 4-20. PLL characteristics .. 70 Table 4-21. PLL1 characteristics .. 71 Table 4-22. PLL2 characteristics .. 71 Table 4-23. PLLUSB characteristics .. 71 Table 4-24. Flash memory characteristics .. 72 Table 4-25. NRST pin characteristics .. 72 Table 4-26. I/O port DC characteristics (1)(3) ... 73 Table 4-27. I/O port AC characteristics (1)(2) ... 74 Table 4-28. Temperature sensor characteristics (1) .. 74 Table 4-29. ADC characteristics ... 75 Table 4-30. ADC RAIN max for fADC = 35 MHz .. 75 Table 4-31. ADC dynamic accuracy at fADC = 14 MHz (1) ... 76 Table 4-32. ADC dynamic accuracy at fADC = 35 MHz (1) ... 76 Table 4-33. ADC static accuracy at fADC = 14 MHz (1) .. 76 Table 4-34. DAC characteristics ... 77
5 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E503Zx LQFP144 pin definitions 2.6.2. GD32E503Vx LQFP100 pin definitions 2.6.3. GD32E503Rx LQFP64 pin definitions 2.6.4. GD32E503Cx LQFP48 pin definitions 3. Functional description 3.1. Arm® Cortex®-M33 core 3.2. Embedded memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal Serial Bus full-speed device interface (USBD) 3.17. Controller area network (CAN) 3.18. External memory controller (EXMC) 3.19. Secure digital input/output interface (SDIO) 3.20. Super High-Resolution Timer (SHRTIMER) 3.21. Serial/Quad Parallel Interface (SQPI) 3.22. Debug mode 3.23. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. Temperature sensor characteristics 4.14. ADC characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. CAN characteristics 4.21. USBD characteristics 4.22. SDIO characteristics 4.23. EXMC characteristics 4.24. Serial/Quad Parallel Interface (SQPI) characteristics 4.25. Super High-Resolution Timer (SHRTIMER) characteristics 4.26. TIMER characteristics 4.27. WDGT characteristics 4.28. Parameter condition 5. Package information 5.1. LQFP144 package outline dimensions 5.2. LQFP100 package outline dimensions 5.3. LQFP64 package outline dimensions 5.4. LQFP48 package outline dimensions 6. Ordering information 7. Revision history