Datasheet GD32E503xx (GigaDevice) - 8
| 制造商 | GigaDevice |
| 描述 | Arm Cortex-M33 32-bit MCU |
| 页数 / 页 | 98 / 8 — General description |
| 文件格式/大小 | PDF / 2.9 Mb |
| 文件语言 | 英语 |
General description
该数据表的模型线
文件文字版本
GD32E503xx Datasheet
1. General description
The GD32E503xx device belongs to the high performance line of GD32 MCU family. It is a new 32-bit general-purpose microcontroller based on the Arm® Cortex®-M33 core. The Cortex®-M33 processor is a 32-bit processor that possesses low interrupt latency and low- cost debug. The characteristics of integrated and advanced make the Cortex®-M33 processor suitable for market products that require microcontrollers with high performance and low power consumption. The processor is based on the ARMv8 architecture and supports a powerful and scalable instruction set including general data processing I/O control tasks, advanced data processing bit field manipulations and DSP. The GD32E503xx device incorporates the Arm® Cortex®-M33 32-bit processor core operating at up to 180 MHz frequency with Flash accesses 0~4 waiting time to obtain maximum efficiency. It provides up to 512 KB embedded Flash memory and up to 128 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer three 12-bit ADCs, two DACs, up to nine general 16-bit timers, a general 32-bit timer, two basic timers, two PWM advanced timers, as well as standard and advanced communication interfaces: up to three SPIs, three I2Cs, six USARTs, two I2Ss, a SDIO, an USBD and two CANs. Additional peripherals as super high-resolution Timer (SHRTIMER), EXMC interface, Serial/Quad Parallel Interface (SQPI) are included. The device operates from a 1.62 to 3.6 V power supply and available in –40 to +85 °C temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications. The above features make the GD32E503xx devices suitable for a wide range of applications, especially in areas such as industrial control, motor drives, user interface, power monitor and alarm systems, consumer and handheld equipment, gaming and GPS, E-bike, optical module and so on. 7 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E503Zx LQFP144 pin definitions 2.6.2. GD32E503Vx LQFP100 pin definitions 2.6.3. GD32E503Rx LQFP64 pin definitions 2.6.4. GD32E503Cx LQFP48 pin definitions 3. Functional description 3.1. Arm® Cortex®-M33 core 3.2. Embedded memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal Serial Bus full-speed device interface (USBD) 3.17. Controller area network (CAN) 3.18. External memory controller (EXMC) 3.19. Secure digital input/output interface (SDIO) 3.20. Super High-Resolution Timer (SHRTIMER) 3.21. Serial/Quad Parallel Interface (SQPI) 3.22. Debug mode 3.23. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. Temperature sensor characteristics 4.14. ADC characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. CAN characteristics 4.21. USBD characteristics 4.22. SDIO characteristics 4.23. EXMC characteristics 4.24. Serial/Quad Parallel Interface (SQPI) characteristics 4.25. Super High-Resolution Timer (SHRTIMER) characteristics 4.26. TIMER characteristics 4.27. WDGT characteristics 4.28. Parameter condition 5. Package information 5.1. LQFP144 package outline dimensions 5.2. LQFP100 package outline dimensions 5.3. LQFP64 package outline dimensions 5.4. LQFP48 package outline dimensions 6. Ordering information 7. Revision history
1. General description
The GD32E503xx device belongs to the high performance line of GD32 MCU family. It is a new 32-bit general-purpose microcontroller based on the Arm® Cortex®-M33 core. The Cortex®-M33 processor is a 32-bit processor that possesses low interrupt latency and low- cost debug. The characteristics of integrated and advanced make the Cortex®-M33 processor suitable for market products that require microcontrollers with high performance and low power consumption. The processor is based on the ARMv8 architecture and supports a powerful and scalable instruction set including general data processing I/O control tasks, advanced data processing bit field manipulations and DSP. The GD32E503xx device incorporates the Arm® Cortex®-M33 32-bit processor core operating at up to 180 MHz frequency with Flash accesses 0~4 waiting time to obtain maximum efficiency. It provides up to 512 KB embedded Flash memory and up to 128 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer three 12-bit ADCs, two DACs, up to nine general 16-bit timers, a general 32-bit timer, two basic timers, two PWM advanced timers, as well as standard and advanced communication interfaces: up to three SPIs, three I2Cs, six USARTs, two I2Ss, a SDIO, an USBD and two CANs. Additional peripherals as super high-resolution Timer (SHRTIMER), EXMC interface, Serial/Quad Parallel Interface (SQPI) are included. The device operates from a 1.62 to 3.6 V power supply and available in –40 to +85 °C temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications. The above features make the GD32E503xx devices suitable for a wide range of applications, especially in areas such as industrial control, motor drives, user interface, power monitor and alarm systems, consumer and handheld equipment, gaming and GPS, E-bike, optical module and so on. 7 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E503Zx LQFP144 pin definitions 2.6.2. GD32E503Vx LQFP100 pin definitions 2.6.3. GD32E503Rx LQFP64 pin definitions 2.6.4. GD32E503Cx LQFP48 pin definitions 3. Functional description 3.1. Arm® Cortex®-M33 core 3.2. Embedded memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal Serial Bus full-speed device interface (USBD) 3.17. Controller area network (CAN) 3.18. External memory controller (EXMC) 3.19. Secure digital input/output interface (SDIO) 3.20. Super High-Resolution Timer (SHRTIMER) 3.21. Serial/Quad Parallel Interface (SQPI) 3.22. Debug mode 3.23. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. Temperature sensor characteristics 4.14. ADC characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. CAN characteristics 4.21. USBD characteristics 4.22. SDIO characteristics 4.23. EXMC characteristics 4.24. Serial/Quad Parallel Interface (SQPI) characteristics 4.25. Super High-Resolution Timer (SHRTIMER) characteristics 4.26. TIMER characteristics 4.27. WDGT characteristics 4.28. Parameter condition 5. Package information 5.1. LQFP144 package outline dimensions 5.2. LQFP100 package outline dimensions 5.3. LQFP64 package outline dimensions 5.4. LQFP48 package outline dimensions 6. Ordering information 7. Revision history