Datasheet T24 (Vishay) - 4
| 制造商 | Vishay |
| 描述 | Wet Tantalum SMD HI-TMP Capacitors for +200 °C Operation, Tantalum Metal Case With Glass-to-Tantalum Hermetic Seal |
| 页数 / 页 | 7 / 4 — T24. CARRIER TAPE DIMENSIONS. TAPE WIDTH W. TYPE. CASE CODE. (mm). K0 … |
| 文件格式/大小 | PDF / 126 Kb |
| 文件语言 | 英语 |
T24. CARRIER TAPE DIMENSIONS. TAPE WIDTH W. TYPE. CASE CODE. (mm). K0 MAX. B1 MAX. RECOMMENDED REFLOW PROFILES. TURE (°C). TEMPERA. TIME (s)
该数据表的模型线
文件文字版本
T24
www.vishay.com Vishay
CARRIER TAPE DIMENSIONS
in inches [millimeters]
TAPE WIDTH W TYPE CASE CODE P (mm) 1 K0 MAX. B1 MAX.
0.476 ± 0.004 0.31 0.45 T24 C 16 [12.0 ± 0.1] [7.9] [11.3]
RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard TP T - 5 °C C t Max. ramp-up rate = 3 °C/s p Max. ramp-down rate = 6 °C/s TL tL Ts max. Preheat area
TURE (°C)
Ts min. t
TEMPERA
s 25 Time 25 °C to peak
TIME (s) PROFILE FEATURE LEAD (Pb)-FREE ASSEMBLY Preheat / soak
Temperature min. (Ts min.) 150 °C Temperature max. (Ts max.) 200 °C Time (ts) from (Ts min. to Ts max.) 60 s to 120 s
Ramp-up
Ramp-up rate (TL to TP) 3 °C/s max. Liquidus temperature (TL) 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) 245 Time (tp) within 5 °C of the specified 30 s classification temperature (TC) Time 25 °C to peak temperature 8 min max.
Ramp-down
Ramp-down rate (TP to TL) 6 °C/s max. Time 25 °C to peak temperature 8 min max.
PAD DIMENSIONS
in inches [millimeters] D B C A
CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.)
C 0.295 [7.50] 0.138 [3.50] 0.100 [2.50] 0.374 [9.50] Revision: 21-Jan-2021
4
Document Number: 40261 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay
CARRIER TAPE DIMENSIONS
in inches [millimeters]
TAPE WIDTH W TYPE CASE CODE P (mm) 1 K0 MAX. B1 MAX.
0.476 ± 0.004 0.31 0.45 T24 C 16 [12.0 ± 0.1] [7.9] [11.3]
RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard TP T - 5 °C C t Max. ramp-up rate = 3 °C/s p Max. ramp-down rate = 6 °C/s TL tL Ts max. Preheat area
TURE (°C)
Ts min. t
TEMPERA
s 25 Time 25 °C to peak
TIME (s) PROFILE FEATURE LEAD (Pb)-FREE ASSEMBLY Preheat / soak
Temperature min. (Ts min.) 150 °C Temperature max. (Ts max.) 200 °C Time (ts) from (Ts min. to Ts max.) 60 s to 120 s
Ramp-up
Ramp-up rate (TL to TP) 3 °C/s max. Liquidus temperature (TL) 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) 245 Time (tp) within 5 °C of the specified 30 s classification temperature (TC) Time 25 °C to peak temperature 8 min max.
Ramp-down
Ramp-down rate (TP to TL) 6 °C/s max. Time 25 °C to peak temperature 8 min max.
PAD DIMENSIONS
in inches [millimeters] D B C A
CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.)
C 0.295 [7.50] 0.138 [3.50] 0.100 [2.50] 0.374 [9.50] Revision: 21-Jan-2021
4
Document Number: 40261 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000