Datasheet NXH006P120MNF2PTG (ON Semiconductor) - 9
制造商 | ON Semiconductor |
描述 | F2HALFBR Module |
页数 / 页 | 10 / 9 — PACKAGE DIMENSIONS. PIM36 56.7x42.5 (PRESS FIT). GENERIC. MARKING … |
修订版 | P3 |
文件格式/大小 | PDF / 1.8 Mb |
文件语言 | 英语 |
PACKAGE DIMENSIONS. PIM36 56.7x42.5 (PRESS FIT). GENERIC. MARKING DIAGRAM*. DOCUMENT NUMBER: 98AON19725H. DESCRIPTION:. PAGE 1 OF 1
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文件文字版本
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS PIM36 56.7x42.5 (PRESS FIT)
CASE 180BY ISSUE B DATE 28 JAN 2021
GENERIC MARKING DIAGRAM*
XXXXXXXXXXXXXXXXXXXXXX ATYYWW *This information is generic. Please refer to device data XXXXX = Specific Device Code sheet for actual part marking. Pb−Free indicator, “G” or AT = Assembly & Test Site Code microdot “ G”, may or may not be present. Some products YYWW = Year and Work Week Code may not follow the Generic Marking.
DOCUMENT NUMBER: 98AON19725H
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: PIM36 56.7x42.5 (PRESS FIT) PAGE 1 OF 1
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