Datasheet BC182, BC182A, BC182B (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | Amplifier Transistors NPN Silicon |
| 页数 / 页 | 4 / 1 — NPN Silicon. Features. http://onsemi.com. MAXIMUM RATINGS. Rating. … |
| 修订版 | 5 |
| 文件格式/大小 | PDF / 56 Kb |
| 文件语言 | 英语 |
NPN Silicon. Features. http://onsemi.com. MAXIMUM RATINGS. Rating. Symbol. BC182. Unit. MARKING. DIAGRAM. TO−92. CASE 29. STYLE 17
该数据表的模型线
文件文字版本
BC182, BC182A, BC182B Amplifier Transistors
NPN Silicon Features
• Pb−Free Packages are Available*
http://onsemi.com
COLLECTOR 1 2 BASE
MAXIMUM RATINGS Rating Symbol BC182 Unit
3 Collector −Emitter Voltage VCEO 50 Vdc EMITTER Collector −Base Voltage VCBO 60 Vdc
MARKING
Emitter −Base Voltage VEBO 6.0 Vdc
DIAGRAM
Collector Current − Continuous IC 100 mAdc Total Device Dissipation @ TA = 25°C PD 350 mW BC Derate above 25°C 2.8 mW/°C
TO−92
182x
CASE 29
Total Device Dissipation @ T AYWWG C = 25°C PD 1.0 W 1
STYLE 17
G Derate above 25°C 8.0 mW/°C 2 3 Operating and Storage Junction TJ, Tstg −55 to +150 °C Temperature Range Maximum ratings are those values beyond which device damage can occur. BC182x = Device Code Maximum ratings applied to the device are individual stress limit values (not x = A or B normal operating conditions) and are not valid simultaneously. If these limits are A = Assembly Location exceeded, device functional operation is not implied, damage may occur and Y = Year reliability may be affected. WW = Work Week G = Pb−Free Package
THERMAL CHARACTERISTICS
(Note: Microdot may be in either location)
Characteristic Symbol Max Unit
Thermal Resistance, R
ORDERING INFORMATION
qJA 357 °C/W Junction−to−Ambient
Device Package Shipping
† Thermal Resistance, RqJC 125 °C/W BC182 TO−92 5000 Units / Box Junction−to−Case BC182G TO−92 5000 Units / Box (Pb−Free) BC182A TO−92 5000 Units / Box BC182AG TO−92 5000 Units / Box (Pb−Free) BC182B TO−92 5000 Units / Box BC182BG TO−92 5000 Units / Box (Pb−Free) BC182BRL1 TO−92 2000 / Tape & Reel BC182BRL1G TO−92 2000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please *For additional information on our Pb−Free strategy and soldering details, please refer to our Tape and Reel Packaging Specifications download the ON Semiconductor Soldering and Mounting Techniques Brochure, BRD8011/D. Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
September, 2005 − Rev. 4 BC182/D
NPN Silicon Features
• Pb−Free Packages are Available*
http://onsemi.com
COLLECTOR 1 2 BASE
MAXIMUM RATINGS Rating Symbol BC182 Unit
3 Collector −Emitter Voltage VCEO 50 Vdc EMITTER Collector −Base Voltage VCBO 60 Vdc
MARKING
Emitter −Base Voltage VEBO 6.0 Vdc
DIAGRAM
Collector Current − Continuous IC 100 mAdc Total Device Dissipation @ TA = 25°C PD 350 mW BC Derate above 25°C 2.8 mW/°C
TO−92
182x
CASE 29
Total Device Dissipation @ T AYWWG C = 25°C PD 1.0 W 1
STYLE 17
G Derate above 25°C 8.0 mW/°C 2 3 Operating and Storage Junction TJ, Tstg −55 to +150 °C Temperature Range Maximum ratings are those values beyond which device damage can occur. BC182x = Device Code Maximum ratings applied to the device are individual stress limit values (not x = A or B normal operating conditions) and are not valid simultaneously. If these limits are A = Assembly Location exceeded, device functional operation is not implied, damage may occur and Y = Year reliability may be affected. WW = Work Week G = Pb−Free Package
THERMAL CHARACTERISTICS
(Note: Microdot may be in either location)
Characteristic Symbol Max Unit
Thermal Resistance, R
ORDERING INFORMATION
qJA 357 °C/W Junction−to−Ambient
Device Package Shipping
† Thermal Resistance, RqJC 125 °C/W BC182 TO−92 5000 Units / Box Junction−to−Case BC182G TO−92 5000 Units / Box (Pb−Free) BC182A TO−92 5000 Units / Box BC182AG TO−92 5000 Units / Box (Pb−Free) BC182B TO−92 5000 Units / Box BC182BG TO−92 5000 Units / Box (Pb−Free) BC182BRL1 TO−92 2000 / Tape & Reel BC182BRL1G TO−92 2000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please *For additional information on our Pb−Free strategy and soldering details, please refer to our Tape and Reel Packaging Specifications download the ON Semiconductor Soldering and Mounting Techniques Brochure, BRD8011/D. Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
September, 2005 − Rev. 4 BC182/D