Datasheet PAM8965 (Diodes) - 4

PAM8965 Absolute Maximum Ratings
(@TA = +25°C, unless otherwise specified.) (Note 4)
Symbol Parameter Rating Unit
VBAT Supply Voltage (Pins VBAT1, VBAT2) -0.3 to +9.0 V VRINP, VRINN, VLINP, VLINN Audio Input Voltage -0.3 to +5.5 V VPLIM, VGAIN, VSSM Control Input Voltage -0.3 to +6.0 V VEN Control Input Voltage -0.3 to VBAT V TJ_MAX Maximum Operating Junction Temperature (Note 5) -40 to +150 °C TSTG Storage Temperature Range -40 to +150 °C HBM Human Body Model ±2000 V CDM Charged Device Model ±1000 V Note 4. Stresses greater than the Absolute Maximum Ratings specified above can cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability can be affected by exposure to absolute maximum rating conditions for extended periods of time.
Recommended Operating Conditions
(@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
VBAT Supply Voltage (Pins VBAT1, VBAT2) 2.8 8.5 V VRINP, VRINN, VLINP, VLINN Audio Input Voltage 0.0 5.0 V VPLIM, VGAIN, VSSM Control Input Voltage 0.0 5.5 V VEN Control Input Voltage 0.0 VBAT V Minimum Load Resistance (VBAT ≤ 5.0V) 6 — RLMIN Ω Minimum Load Resistance (VBAT > 5.0V) 4 — TA Operating Free-Air Temperature Range -40 +85 °C TJ Operating Junction Temperature Range (Note 5) -40 +125 °C Note 5. The PAM8965 incorporates an exposed thermal pad on the underside of the chip, which acts as a heatsink. The exposed pad must be connected to a thermally dissipating Cu plane on the PCB for adequate power dissipation. Failure to do so may result in the device going into thermal shutdown.
Thermal Information Parameter Symbol Package Rating Unit
Thermal Resistance (Junction to Ambient) θJA W-QFN5050-40 (Type US) 33 °C/W Thermal Resistance (Junction to Case) θJC W-QFN5050-40 (Type US) 10 °C/W PAM8965 4 of 25 May 2021 Document number: DS42707 Rev. 2 - 2
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