Datasheet T1610, T1635, T1650, BTA16, BTB16 (STMicroelectronics) - 4
| 制造商 | STMicroelectronics |
| 描述 | Snubberless, logic level and standard 16 A Triacs |
| 页数 / 页 | 18 / 4 — T1610, T1635, T1650, BTA16, BTB16. Characteristics (curves). 1.1. Figure … |
| 文件格式/大小 | PDF / 232 Kb |
| 文件语言 | 英语 |
T1610, T1635, T1650, BTA16, BTB16. Characteristics (curves). 1.1. Figure 2. Maximum power dissipation versus on-state
该数据表的模型线
- BTA16-600B BTA16-600BRG BTA16-600BWRG BTA16-600CRG BTA16-600CWRG BTA16-600SWRG BTA16-800BRG BTA16-800BWRG BTA16-800CWRG BTA16-800SWRG
文件文字版本
T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Maximum power dissipation versus on-state Figure 3. RMS on-state current versus case temperature RMS current (full cycle) (full cycle)
P(W) IT(RMS)(A) 20 18 18 16 16 BTB/T16 14 14 BTA 12 12 10 10 8 8 6 6 4 4 2 2 IT T (RMS)(A) c(°C) 0 0 0 2 4 6 8 10 12 14 16 0 25 50 75 100 125
Figure 4. On-state rms current versus ambient Figure 5. Relative variation of thermal impedance versus temperature (full cycle) pulse duration
IT(RMS)(A) K = [Zth/Rth] 4.0 1E+0 3.5 Zth(j-c) D²PAK Printed circuit board FR4, copper thickness: 35 µm 3.0 (S = 1 cm²) 2.5 Zth(j-a) 2.0 1E-1 1.5 1.0 0.5 Tc(°C) tp(s) 0.0 1E-2 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
DS2114
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Rev 11 page 4/18
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 TO-220AB Insulated and non Insulated package information 2.1.1 TO-220AB Insulated and non Insulated package information 2.2 D²PAK package information 2.2.1 D²PAK package information 3 Ordering information 3.1 Product selector 3.2 Ordering information Revision history
P(W) IT(RMS)(A) 20 18 18 16 16 BTB/T16 14 14 BTA 12 12 10 10 8 8 6 6 4 4 2 2 IT T (RMS)(A) c(°C) 0 0 0 2 4 6 8 10 12 14 16 0 25 50 75 100 125
Figure 4. On-state rms current versus ambient Figure 5. Relative variation of thermal impedance versus temperature (full cycle) pulse duration
IT(RMS)(A) K = [Zth/Rth] 4.0 1E+0 3.5 Zth(j-c) D²PAK Printed circuit board FR4, copper thickness: 35 µm 3.0 (S = 1 cm²) 2.5 Zth(j-a) 2.0 1E-1 1.5 1.0 0.5 Tc(°C) tp(s) 0.0 1E-2 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
DS2114
-
Rev 11 page 4/18
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 TO-220AB Insulated and non Insulated package information 2.1.1 TO-220AB Insulated and non Insulated package information 2.2 D²PAK package information 2.2.1 D²PAK package information 3 Ordering information 3.1 Product selector 3.2 Ordering information Revision history