ASMT-Rx45-xxxxx Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED Figure 7: Recommended Reflow Soldering ProfileFigure 8: Recommended Pb-Free Reflow Soldering Profile10 SEC. MAX.10 to 30 SEC.255 - 260ºC230ºC/ MAX.3ºC/SEC. MAX.217ºC 200ºC140-1604ºC/SEC. MAX.6ºC/SEC. MAX.150ºCTEMPERATURETEMPERATURE4ºC/SEC.-3ºC/SEC.3ºC/SEC. MAX.MAX.MAX.60 - 120 SEC.100 SEC. MAX.OVER 2 MIN.TIMETIME(Acc. to J-STD-020C)NOTE: For detailed information on reflow soldering of Broadcom surface mount LEDs, refer to Broadcom Application Note AN1060, Surface Mounting SMT LED Indicator Components. Figure 9: Tape Dimensions4.00DIM. C[0.157][SEE TABLE 1]1.500.254 +/- 0.02[0.059]4.00[0.01 +/- 0.001][0.157]1.75[0.069]3.50 +/- 0.058.00 +/- 0.30[0.315 +/- 0.012]DIM. A[0.14 +/- 0.002][SEE TABLE]CARRIER TAPEDiam. 0.60 +/- 0.05DIM. BUSER FEEDCOVER TAPE[SEE TABLE]DIRECTIONFigure 10: Reeling OrientationUSER FEED DIRECTIONCATHODE SIDEPRINTED LABEL Broadcom AV02-0378EN 5 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity