Datasheet MC14093B (ON Semiconductor) - 9

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页数 / 页9 / 9 — MC14093B. PACKAGE DIMENSIONS. SOEIAJ−14. E HE. DETAIL P. MILLIMETERS. …
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MC14093B. PACKAGE DIMENSIONS. SOEIAJ−14. E HE. DETAIL P. MILLIMETERS. INCHES. VIEW P. DIM. MIN. MAX. PUBLICATION ORDERING INFORMATION

MC14093B PACKAGE DIMENSIONS SOEIAJ−14 E HE DETAIL P MILLIMETERS INCHES VIEW P DIM MIN MAX PUBLICATION ORDERING INFORMATION

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MC14093B PACKAGE DIMENSIONS SOEIAJ−14
CASE 965 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE
14 8 LE
MEASURED AT THE PARTING LINE. MOLD FLASH
Q
OR PROTRUSIONS SHALL NOT EXCEED 0.15
1
(0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR
E HE M
_ REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
L
TOTAL IN EXCESS OF THE LEAD WIDTH
1 7
DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER
DETAIL P Z
RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD
D
TO BE 0.46 ( 0.018).
MILLIMETERS INCHES VIEW P DIM MIN MAX MIN MAX e A A
--- 2.05 --- 0.081
c A1
0.05 0.20 0.002 0.008
b
0.35 0.50 0.014 0.020
c
0.10 0.20 0.004 0.008
D
9.90 10.50 0.390 0.413
b A1 E
5.10 5.45 0.201 0.215
e
1.27 BSC 0.050 BSC
H
0.13 (0.005) M
E
7.40 8.20 0.291 0.323 0.10 (0.004)
L
0.50 0.85 0.020 0.033
LE
1.10 1.50 0.043 0.059
M
0 _ 10 _ 0 _ 10 _
Q1
0.70 0.90 0.028 0.035
Z
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