Datasheet ADR1399 (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | Oven-Compensated, Buried Zener, 7.05 V Voltage Reference |
| 页数 / 页 | 11 / 4 — ADR1399. ABSOLUTE MAXIMUM RATINGS. Table 3. THERMAL RESISTANCE. … |
| 文件格式/大小 | PDF / 2.3 Mb |
| 文件语言 | 英语 |
ADR1399. ABSOLUTE MAXIMUM RATINGS. Table 3. THERMAL RESISTANCE. Parameter. Rating. Table 4. Thermal Resistance. Package Type. θJC. Unit
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ADR1399 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to the printed circuit board Temperature Stabilizer 40 V (PCB) design and operating environment. Close attention to the Reverse Breakdown Current 20 mA PCB thermal design is required. Forward Current 1 mA Reference to Substrate Voltage –0.1 V To reduce heater power, avoid bringing ground planes close to the Temperature device except on the bottom of the PCB, and use a mesh ground instead of a solid plane. In addition, mounting the device at the Operating Range 0°C to 70°C full height of its leads, approximately 1 cm above the PCB surface Storage Range −65°C to +150°C reduces the heater power. Lead, Soldering (10 sec) 300°C
Table 4. Thermal Resistance
Stresses at or above those listed under Absolute Maximum Ratings
Package Type θ
may cause permanent damage to the product. This is a stress
JA θJC Unit
rating only; functional operation of the product at these or any other TO-46 conditions above those indicated in the operational section of this 2-Layer JEDEC Board 220 Not °C/W specification is not implied. Operation beyond the maximum operat- applicable1 ing conditions for extended periods may affect product reliability. 1 The TO-46 case is not accessible beneath the Valox enclosure.
ESD CAUTION ESD (electrostatic discharge) sensitive device
. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
analog.com Rev. 0 | 4 of 11
Document Outline Features Applications Pin Configuration General Description Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Operating Set Temperature Thermal Resistance Applications Information Avoiding Thermocouple Errors Shunt Dynamic Impedance and Capacitive Load Typical Applications Outline Dimensions Ordering Guide
ADR1399 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to the printed circuit board Temperature Stabilizer 40 V (PCB) design and operating environment. Close attention to the Reverse Breakdown Current 20 mA PCB thermal design is required. Forward Current 1 mA Reference to Substrate Voltage –0.1 V To reduce heater power, avoid bringing ground planes close to the Temperature device except on the bottom of the PCB, and use a mesh ground instead of a solid plane. In addition, mounting the device at the Operating Range 0°C to 70°C full height of its leads, approximately 1 cm above the PCB surface Storage Range −65°C to +150°C reduces the heater power. Lead, Soldering (10 sec) 300°C
Table 4. Thermal Resistance
Stresses at or above those listed under Absolute Maximum Ratings
Package Type θ
may cause permanent damage to the product. This is a stress
JA θJC Unit
rating only; functional operation of the product at these or any other TO-46 conditions above those indicated in the operational section of this 2-Layer JEDEC Board 220 Not °C/W specification is not implied. Operation beyond the maximum operat- applicable1 ing conditions for extended periods may affect product reliability. 1 The TO-46 case is not accessible beneath the Valox enclosure.
ESD CAUTION ESD (electrostatic discharge) sensitive device
. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
analog.com Rev. 0 | 4 of 11
Document Outline Features Applications Pin Configuration General Description Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Operating Set Temperature Thermal Resistance Applications Information Avoiding Thermocouple Errors Shunt Dynamic Impedance and Capacitive Load Typical Applications Outline Dimensions Ordering Guide