F DN30Typical Characteristics2 P 5 1400 ) V ID = -2.4A VDS = -5V f = 1MHz ( -10V 1200 E V = 0 V 4 GS -15V ) F 1000 LTAGp C O( ISS V 3 800 URCE O 600 2 -SACITANCETE ACAP 400 , G 1 COSS GS 200 -V CRSS 0 0 0 2 4 6 8 10 0 2 4 6 8 10 12 Qg, GATE CHARGE (nC)-VDS, DRAIN TO SOURCE VOLTAGE (V)Figure 7. Gate Charge Characteristics.Figure 8. Capacitance Characteristics. 100 20 ) SINGLE PULSE W R R LIMIT θJA = 270°C/W DS(ON) R () TA = 25°C A 10 1ms WE 15 O 10ms NT ( 100ms NT P 1s IE 1 10 10s DC VGS =-4.5V , DRAIN CURRE SINGLE PULSE AK TRANSD 0.1 E 5 -I Rθ = 270oC/W JA ), P T = 25oC A (pk P 0.01 0 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000 -VDS, DRAIN-SOURCE VOLTAGE (V)t1, TIME (sec)Figure 9. Maximum Safe Operating Area.Figure 10. Single Pulse MaximumPower Dissipation. 1 ANCE D = 0.5 ST RθJA(t) = r(t) + RθJA 0.2 RθJA = 270 °C/W 0.1 RESI 0.1 L A 0.05 P(pk) 0.02 ERM t ALIZED EFFECTIVEH 1 0.01 T 0.01 t2 RMNT T E J - TA = P * RθJA(t) SINGLE PULSE Duty Cycle, D = t1 / t2 r(t), NORANSI 0.001 T 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec)Figure 11. Transient Thermal Response Curve.Thermal characterization performed using the conditions described in Note 1b. Transient themal response will change depending on the circuit board design. FDN302P Rev C(W)