Datasheet SGP30 (Sensirion)

Datasheet SGP30
Indoor Air Quality Sensor for TVOC and CO2eq Measurements  Multi-pixel gas sensor for indoor air quality applications  Outstanding long-term stability  I2C interface with TVOC and CO2eq output signals  Very small 6-pin DFN package: 2.45 x 2.45 x 0.9 mm3  Low power consumption: 48 mA at 1.8V  Tape and reel packaged, reflow solderable
Product Summary
The SGP30 is a digital multi-pixel gas sensor designed for The sensing element features an unmatched robustness easy integration into air purifier, demand-controlled against contaminating gases present in real-world ventilation, and IoT applications. Sensirion’s CMOSens® applications enabling a unique long-term stability and low technology offers a complete sensor system on a single drift. The very small 2.45 x 2.45 x 0.9 mm3 DFN package chip featuring a digital I2C interface, a temperature enables applications in limited spaces. Sensirion’s controlled micro hotplate, and two preprocessed indoor air state-of-the-art production process guarantees high quality signals. As the first metal-oxide gas sensor reproducibility and reliability. Tape and reel packaging, featuring multiple sensing elements on one chip, the together with suitability for standard SMD assembly SGP30 provides more detailed information about the air processes make the SGP30 predestined for high-volume quality. applications.
Figure 1
Functional block diagram of the SGP30. www.sensirion.com Version 1.0 – May 2020 – D1 1/19 Document Outline 1 Sensor Performance 1.1 Gas Sensing Performance 1.2 Air Quality Signals 1.3 Recommended Operating and Storage Conditions 2 Electrical Specifications 3 Interface Specifications The SGP30 comes in a 6-pin DFN package, see Table 4. 4 Absolute Minimum and Maximum Ratings 5 Timing Specifications 5.1 Sensor System Timings 5.2 Communication Timings 6 Operation and Communication 6.1 Power-Up and Communication Start 6.2 Measurement Communication Sequence 6.3 Measurement Commands 6.4 Soft Reset 6.5 Get Serial ID 6.6 Checksum Calculation 6.7 Communication Data Sequences 7 Quality 7.1 Environmental Stability 7.2 Material Contents 8 Device Package 8.1 Moisture Sensitivity Level 8.2 Traceability 8.3 Package Outline 8.4 Landing Pattern 8.5 Soldering Instructions 9 Tape & Reel Package 10 Ordering Information Revision History Important Notices Warning, Personal Injury ESD Precautions Warranty Headquarters and Subsidiaries