Datasheet TCK127BG (Toshiba) - 6
| 制造商 | Toshiba |
| 描述 | 0.08 nA Ultra small IQ 1.0 A Load Switch IC in Ultra Small Package |
| 页数 / 页 | 13 / 6 — TCK127BG. 2. Power Dissipation. 2000. 1600. 1200. oni. pati. 800. di r. … |
| 文件格式/大小 | PDF / 1.0 Mb |
| 文件语言 | 英语 |
TCK127BG. 2. Power Dissipation. 2000. 1600. 1200. oni. pati. 800. di r. owe. 400. −40. 120. Ambient temperature Ta (°C)
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TCK127BG 2. Power Dissipation
Board-mounted power dissipation ratings are available in the Absolute Maximum Ratings table. Power dissipation is measured on the board condition shown below. [The Board Condition] Glass epoxy board dimension : 40 mm x 40 mm , 4 layer Metal pattern ratio : approximately 70% each layer
2000 ) 1600 W m( DP 1200 oni pati ss 800 di r owe P 400 0 −40 0 40 80 120 Ambient temperature Ta (°C)
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration the ambient temperature, input voltage, output current etc. and applying the appropriate derating for allowable power dissipation during operation. © 2021 6 2021-10-28 Toshiba Electronic Devices & Storage Corporation
Board-mounted power dissipation ratings are available in the Absolute Maximum Ratings table. Power dissipation is measured on the board condition shown below. [The Board Condition] Glass epoxy board dimension : 40 mm x 40 mm , 4 layer Metal pattern ratio : approximately 70% each layer
2000 ) 1600 W m( DP 1200 oni pati ss 800 di r owe P 400 0 −40 0 40 80 120 Ambient temperature Ta (°C)
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration the ambient temperature, input voltage, output current etc. and applying the appropriate derating for allowable power dissipation during operation. © 2021 6 2021-10-28 Toshiba Electronic Devices & Storage Corporation