Datasheet BAT46 (STMicroelectronics) - 4

Characteristics BAT46 Series Figure 7. Forward voltage drop versus Figure 8. Relative variation of thermal forward current (typical values, impedance junction to ambient high-level) versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) IFM(A) Z /R th(j-a) th(j-a) 1.E+00 1.00
Single pulse SOD-323 Tj=125 °C
1.E-01
Tj=25 °C
0.10
Epoxy FR4 S =2.25 mm² CU e =35 µm
V
CU
FM(V) tP(s) 1.E-02 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 Figure 9. Relative variation of thermal Figure 10. Variation of thermal impedance impedance junction to ambient junction to ambient versus pulse versus pulse duration - duration - printed circuit board, aluminium oxide substrate epoxy FR4, eCU = 35 µm (SOT-323) 10 mm x 8 mm x 0.5 mm (SOT-23) Z /R th(j-a) th(j-a) Z (°C/W) th(j-a) 1.00 1000
Single pulse Single pulse SOT-23 SOT-323
0.10 100
Alumine substrate 10 x 8 x 0.5 mm
tP(s) tP(s) 0.01 10 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) R (°C/W) th(j-a) 600 550 500 450 400 350 SCU(mm²) 300 0 5 10 15 20 25 30 35 40 45 50
4/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history