Datasheet MAX6033 (Maxim) - 2
| 制造商 | Maxim |
| 描述 | High-Precision, Low-Dropout SOT23 Series Voltage Reference |
| 页数 / 页 | 13 / 2 — Absolute Maximum Ratings. Package Information. 6 SOT23. PACKAGE CODE. … |
| 文件格式/大小 | PDF / 1.8 Mb |
| 文件语言 | 英语 |
Absolute Maximum Ratings. Package Information. 6 SOT23. PACKAGE CODE. U6F+6. 21-0058. 90-0175. Thermal Resistance, Single-Layer Board
该数据表的模型线
文件文字版本
MAX6033 High-Precision, Low-Dropout SOT23 Series Voltage Reference
Absolute Maximum Ratings
IN to GND ..-0.3V to +13V Maximum Junction Temperature ...+150°C OUTF, OUTS to GND ..-0.3V to +6V Lead Temperature (soldering, 10s) ...+300°C Continuous Power Dissipation (TA = +70°C) Soldering Temperature (reflow) 6-Pin SOT23 (derate 7.40mW/°C above +70°C) ...595.20mW RoHS-Compliant Packages ...+245°C Operating Temperature Range ... -40°C to +125°C Packages Containing Lead(Pb) ...+240°C Storage Temperature Range .. -65°C to +150°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 6 SOT23 PACKAGE CODE U6F+6
Outline Number
21-0058
Land Pattern Number
90-0175 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.50 Junction to Case (θJC) 75
Thermal Resistance, Four-Layer Board
Junction to Ambient (θJA) 134.40 Junction to Case (θJC) 39
RoHS SOT23-6 PACKAGE CODE U6FH+6
Outline Number
—
Land Pattern Number
— Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.50 Junction to Case (θJC) 75
Thermal Resistance, Four-Layer Board
Junction to Ambient (θJA) 134.40 Junction to Case (θJC) 39 For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 2 Document Outline _GoBack
Absolute Maximum Ratings
IN to GND ..-0.3V to +13V Maximum Junction Temperature ...+150°C OUTF, OUTS to GND ..-0.3V to +6V Lead Temperature (soldering, 10s) ...+300°C Continuous Power Dissipation (TA = +70°C) Soldering Temperature (reflow) 6-Pin SOT23 (derate 7.40mW/°C above +70°C) ...595.20mW RoHS-Compliant Packages ...+245°C Operating Temperature Range ... -40°C to +125°C Packages Containing Lead(Pb) ...+240°C Storage Temperature Range .. -65°C to +150°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 6 SOT23 PACKAGE CODE U6F+6
Outline Number
21-0058
Land Pattern Number
90-0175 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.50 Junction to Case (θJC) 75
Thermal Resistance, Four-Layer Board
Junction to Ambient (θJA) 134.40 Junction to Case (θJC) 39
RoHS SOT23-6 PACKAGE CODE U6FH+6
Outline Number
—
Land Pattern Number
— Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.50 Junction to Case (θJC) 75
Thermal Resistance, Four-Layer Board
Junction to Ambient (θJA) 134.40 Junction to Case (θJC) 39 For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 2 Document Outline _GoBack