Datasheet BF820, BF822 (Nexperia) - 5
| 制造商 | Nexperia |
| 描述 | NPN high-voltage transistors |
| 页数 / 页 | 7 / 5 — PACKAGE OUTLINE. Plastic surface-mounted package; 3 leads. SOT23. … |
| 修订版 | 15012004 |
| 文件格式/大小 | PDF / 290 Kb |
| 文件语言 | 英语 |
PACKAGE OUTLINE. Plastic surface-mounted package; 3 leads. SOT23. DIMENSIONS (mm are the original dimensions). UNIT. max
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NXP Semiconductors Product data sheet NPN high-voltage transistors BF820; BF822
PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v max. 1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-11-04 SOT23 TO-236AB 06-03-16 2004 Jan 16 4 Document Outline Features Applications Description Marking Pinning Ordering information Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v max. 1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-11-04 SOT23 TO-236AB 06-03-16 2004 Jan 16 4 Document Outline Features Applications Description Marking Pinning Ordering information Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers