Datasheet ADG1408, ADG1409 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | 4 Ω RON, 4-/8-Channel, ±15 V/+12 V/±5 V iCMOS Multiplexers |
| 页数 / 页 | 19 / 10 — ADG1408/ADG1409. Data Sheet. PIN CONFIGURATIONS AND FUNCTION … |
| 修订版 | D |
| 文件格式/大小 | PDF / 373 Kb |
| 文件语言 | 英语 |
ADG1408/ADG1409. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. A0 1. 16 A1. EN 2. 15 A2. GND. ADG1408. S1 4. TOP VIEW. 13 VDD
该数据表的模型线
文件文字版本
ADG1408/ADG1409 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS EN A0 A1 A2 A0 1 16 A1 61 51 41 31 EN 2 15 A2 V 3 14 SS GND ADG1408 V 1 12 SS GND S1 4 TOP VIEW 13 VDD (Not to Scale) S1 2 11 VDD ADG1408 S2 5 12 S5 S2 3 TOP VIEW 10 S5 (Not to Scale) S3 6 11 S6 S3 4 9 S6 S4 7 10 S7
2
5 6 7 8 D 8 9 S8
-00 61
S4 D S8 S7
48 0
NOTES 1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
03 0
RECOMMENDED THAT THE PAD BE
1-
SOLDERED TO THE SUBSTRATE, VSS.
486 0 Figure 2. ADG1408 Pin Configuration (TSSOP) Figure 3. ADG1408 Pin Configuration (LFCSP)
Table 8. ADG1408 Pi n Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single supply applications, it can be connected to ground. 4 2 S1 Source Terminal 1. Can be an input or an output. 5 3 S2 Source Terminal 2. Can be an input or an output. 6 4 S3 Source Terminal 3. Can be an input or an output. 7 5 S4 Source Terminal 4. Can be an input or an output. 8 6 D Drain Terminal. Can be an input or an output. 9 7 S8 Source Terminal 8. Can be an input or an output. 10 8 S7 Source Terminal 7. Can be an input or an output. 11 9 S6 Source Terminal 6. Can be an input or an output. 12 10 S5 Source Terminal 5. Can be an input or an output. 13 11 VDD Most Positive Power Supply Potential. 14 12 GND Ground (0 V) Reference. 15 13 A2 Logic Control Input. 16 14 A1 Logic Control Input. Not 0 EPAD Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and applicable maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1408 Truth Table A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. D | Page 10 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 15 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V DUAL SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
2
5 6 7 8 D 8 9 S8
-00 61
S4 D S8 S7
48 0
NOTES 1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
03 0
RECOMMENDED THAT THE PAD BE
1-
SOLDERED TO THE SUBSTRATE, VSS.
486 0 Figure 2. ADG1408 Pin Configuration (TSSOP) Figure 3. ADG1408 Pin Configuration (LFCSP)
Table 8. ADG1408 Pi n Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single supply applications, it can be connected to ground. 4 2 S1 Source Terminal 1. Can be an input or an output. 5 3 S2 Source Terminal 2. Can be an input or an output. 6 4 S3 Source Terminal 3. Can be an input or an output. 7 5 S4 Source Terminal 4. Can be an input or an output. 8 6 D Drain Terminal. Can be an input or an output. 9 7 S8 Source Terminal 8. Can be an input or an output. 10 8 S7 Source Terminal 7. Can be an input or an output. 11 9 S6 Source Terminal 6. Can be an input or an output. 12 10 S5 Source Terminal 5. Can be an input or an output. 13 11 VDD Most Positive Power Supply Potential. 14 12 GND Ground (0 V) Reference. 15 13 A2 Logic Control Input. 16 14 A1 Logic Control Input. Not 0 EPAD Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and applicable maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1408 Truth Table A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. D | Page 10 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 15 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V DUAL SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE