Datasheet ADG613-EP (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | 1 pC Charge Injection, 100 pA Leakage, CMOS, ±5 V/ +5 V/ +3 V, Quad SPST Switches |
| 页数 / 页 | 12 / 6 — ADG613-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. Table 4. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 258 Kb |
| 文件语言 | 英语 |
ADG613-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. Table 4. Parameter. Rating. ESD CAUTION
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文件文字版本
ADG613-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted Stresses at or above those listed under Absolute Maximum
Table 4.
Ratings may cause permanent damage to the product. This is a
Parameter Rating
stress rating only; functional operation of the product at these V or any other conditions above those indicated in the operational 1 DD to VSS 13 V V section of this specification is not implied. Operation beyond DD to GND1 −0.3 V to +6.5 V the maximum operating conditions for extended periods may VSS to GND1 +0.3 V to −6.5 V affect product reliability. Analog Inputs2 VSS − 0.3 V to VDD + 0.3 V Digital Inputs2 GND − 0.3 V to VDD + 0.3 V or Only one absolute maximum rating can be applied at any one time. 30 mA, whichever occurs first Peak Current, Sx or Dx 20 mA (pulsed at 1 ms, 10% duty cycle maximum)
ESD CAUTION
Continuous Current, Sx or Dx 10 mA 3 V Operation, 85°C to 125°C 7.5 mA Operating Temperature Range −55°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C θJA Thermal Impedance 16-Lead TSSOP 150.4°C/W Lead Soldering Lead Temperature, Soldering 300°C (10 sec) IR Reflow, Peak Temperature 220°C (<20 sec) Pb-Free Soldering Reflow, Peak Temperature 260 (+0/−5)°C Time at Peak Temperature 20 sec to 40 sec 1 Tested at −55°C to +125°C. 2 Overvoltages at INx, Sx, or Dx are clamped by internal diodes. Limit the current to the maximum ratings given. Tested at −55°C to +125°C. Rev. A | Page 6 of 12 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS DUAL-SUPPLY OPERATION SINGLE-SUPPLY OPERATION ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted Stresses at or above those listed under Absolute Maximum
Table 4.
Ratings may cause permanent damage to the product. This is a
Parameter Rating
stress rating only; functional operation of the product at these V or any other conditions above those indicated in the operational 1 DD to VSS 13 V V section of this specification is not implied. Operation beyond DD to GND1 −0.3 V to +6.5 V the maximum operating conditions for extended periods may VSS to GND1 +0.3 V to −6.5 V affect product reliability. Analog Inputs2 VSS − 0.3 V to VDD + 0.3 V Digital Inputs2 GND − 0.3 V to VDD + 0.3 V or Only one absolute maximum rating can be applied at any one time. 30 mA, whichever occurs first Peak Current, Sx or Dx 20 mA (pulsed at 1 ms, 10% duty cycle maximum)
ESD CAUTION
Continuous Current, Sx or Dx 10 mA 3 V Operation, 85°C to 125°C 7.5 mA Operating Temperature Range −55°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C θJA Thermal Impedance 16-Lead TSSOP 150.4°C/W Lead Soldering Lead Temperature, Soldering 300°C (10 sec) IR Reflow, Peak Temperature 220°C (<20 sec) Pb-Free Soldering Reflow, Peak Temperature 260 (+0/−5)°C Time at Peak Temperature 20 sec to 40 sec 1 Tested at −55°C to +125°C. 2 Overvoltages at INx, Sx, or Dx are clamped by internal diodes. Limit the current to the maximum ratings given. Tested at −55°C to +125°C. Rev. A | Page 6 of 12 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS DUAL-SUPPLY OPERATION SINGLE-SUPPLY OPERATION ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE