Datasheet ADG601, ADG602 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | 2 Ω, CMOS, ±5 V/+5 V SPST Switches |
| 页数 / 页 | 12 / 6 — ADG601/ADG602. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. … |
| 修订版 | D |
| 文件格式/大小 | PDF / 206 Kb |
| 文件语言 | 英语 |
ADG601/ADG602. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. PIN 1. 8 S. INDICATOR. 6 IN. ADG601/. NC 2. 7 GND. ADG602. 5 D. NC 3
该数据表的模型线
文件文字版本
ADG601/ADG602 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS PIN 1 V D PIN 1 8 S DD 1 INDICATOR 6 IN 1 INDICATOR ADG601/ NC 2 ADG601/ 7 GND S ADG602 2 ADG602 5 D NC 3 6 IN TOP VIEW TOP VIEW (Not to Scale) VDD 4 (Not to Scale) 5 VSS
3 02 00
V
0 9-
SS 3 4 GND
19-
NC = NO CONNECT
26 261 0 0 Figure 2. 6-Lead SOT-23 (RJ-6) Figure 3. 8-Lead MSOP (RM-8)
Table 5. Pin Function Descriptions Pin No. 6-Lead SOT-23 8-Lead MSOP Mnemonic Description
1 4 VDD Most Positive Power Supply Potential. 2 8 S Source Terminal. Can be an input or output. 3 5 VSS Most Negative Power Supply Potential. 4 7 GND Ground (0 V) Reference. 5 1 D Drain Terminal. Can be an input or output. 6 6 IN Logic Control Input. N/A1 2, 3 NC No Connect. 1 N/A is not applicable.
1 14 2 13 3 4 12 5 11 6 10 7 8 9
1 02 9-
TOP VIEW
61
(Not to Scale)
02 Figure 4. Die (820 μm × 2255 μm)
Table 6. Die Pad Coordinates1 Die Pad Coordinates Die Pad No. X (μm) Y (μm) Mnemonic Description
1 −265 +754 NC No Connect. 2 −265 +525 D Drain Terminal. Can be an input or output.2 3 −265 +241 D Drain Terminal. Can be an input or output.2 4 −265 +141 D Drain Terminal. Can be an input or output.2 5 −265 −191 NC No Connect. 6 −265 −409 NC No Connect. 7 −265 −549 NC No Connect. 8 −265 −787 VDD Most Positive Power Supply Potential. 9 +265 −767 VSS Most Negative Power Supply Potential. 10 +265 −429 IN Logic Control Input. 11 +265 −289 GND Ground (0 V) Reference. 12 +265 +189 S Source Terminal. Can be an input or output.3 13 +265 +521 S Source Terminal. Can be an input or output.3 14 +265 +661 NC Source Terminal. Can be an input or output. 1 Measured from the center of the die. 2 Bond the D pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the drain pin of the switch. 3 Bond the S pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the source pin of the switch. Rev. D | Page 6 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
3 02 00
V
0 9-
SS 3 4 GND
19-
NC = NO CONNECT
26 261 0 0 Figure 2. 6-Lead SOT-23 (RJ-6) Figure 3. 8-Lead MSOP (RM-8)
Table 5. Pin Function Descriptions Pin No. 6-Lead SOT-23 8-Lead MSOP Mnemonic Description
1 4 VDD Most Positive Power Supply Potential. 2 8 S Source Terminal. Can be an input or output. 3 5 VSS Most Negative Power Supply Potential. 4 7 GND Ground (0 V) Reference. 5 1 D Drain Terminal. Can be an input or output. 6 6 IN Logic Control Input. N/A1 2, 3 NC No Connect. 1 N/A is not applicable.
1 14 2 13 3 4 12 5 11 6 10 7 8 9
1 02 9-
TOP VIEW
61
(Not to Scale)
02 Figure 4. Die (820 μm × 2255 μm)
Table 6. Die Pad Coordinates1 Die Pad Coordinates Die Pad No. X (μm) Y (μm) Mnemonic Description
1 −265 +754 NC No Connect. 2 −265 +525 D Drain Terminal. Can be an input or output.2 3 −265 +241 D Drain Terminal. Can be an input or output.2 4 −265 +141 D Drain Terminal. Can be an input or output.2 5 −265 −191 NC No Connect. 6 −265 −409 NC No Connect. 7 −265 −549 NC No Connect. 8 −265 −787 VDD Most Positive Power Supply Potential. 9 +265 −767 VSS Most Negative Power Supply Potential. 10 +265 −429 IN Logic Control Input. 11 +265 −289 GND Ground (0 V) Reference. 12 +265 +189 S Source Terminal. Can be an input or output.3 13 +265 +521 S Source Terminal. Can be an input or output.3 14 +265 +661 NC Source Terminal. Can be an input or output. 1 Measured from the center of the die. 2 Bond the D pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the drain pin of the switch. 3 Bond the S pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the source pin of the switch. Rev. D | Page 6 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE