Datasheet ADG888 (Analog Devices) - 6

ADG888 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS D A A DD S1 V GN S4 6 5 4 3 1 1 1 1 D1 1 12 D4 V 1 16 GND S1B 2 ADG888 11 S4B DD TOP VIEW S1A 2 15 S4A S2B 3 10 S3B (Not to Scale) D1 3 14 D4 ADG888 D2 4 9 D3 S1B 4 TOP VIEW 13 S4B (Not to Scale) S2B 5 12 S3B 5 6 7 8 A 1 2 A D2 6 11 D3 S2 IN IN S3 S2A 7 10 S3A
3
NOTES
4 -00 0
1. THE EXPOSED PAD MUST BE 8 IN1 9 IN2
0 2- 5432
CONNECTED TO GROUND.
43 0 05 Figure 2. 16-Lead LFCSP Figure 3. 16-Lead TSSOP Pin Configuration Pin Configuration
Table 4. LFCSP and TSSOP Pin Function Descriptions Pin No. LFCSP TSSOP Mnemonic Description
1 3 D1 Drain Terminal 1. Can be an input or output. 2 4 S1B Source Terminal 1B. Can be an input or output. 3 5 S2B Source Terminal 2B. Can be an input or output. 4 6 D2 Drain Terminal 2. Can be an input or output. 5 7 S2A Source Terminal 2A. Can be an input or output. 6 8 IN1 Logic Control Input. 7 9 IN2 Logic Control Input. 8 10 S3A Source Terminal 3A. Can be an input or output. 9 11 D3 Drain Terminal 3. Can be an input or output. 10 12 S3B Source Terminal 3B. Can be an input or output. 11 13 S4B Source Terminal 4B. Can be an input or output. 12 14 D4 Drain Terminal 4. Can be an input or output. 13 15 S4A Source Terminal 4A. Can be an input or output. 14 16 GND Ground (0 V) Reference. 15 1 VDD Most Positive Power Supply Potential. 16 2 S1A Source Terminal 1A. Can be an input or output. 0 Not applicable EP Exposed Pad. The exposed pad must be connected to ground. Rev. D | Page 6 of 17 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Test Circuits Terminology Outline Dimensions Ordering Guide