Datasheet ADG841-KGD (Analog Devices) - 9
| 制造商 | Analog Devices |
| 描述 | 0.28 Ω, CMOS, 1.65 V to 3.6 V, Single SPST Switch |
| 页数 / 页 | 9 / 9 — Known Good Die. ADG841-KGD. OUTLINE DIMENSIONS. 0.314 0.304 0.294. 0.820 … |
| 修订版 | B |
| 文件格式/大小 | PDF / 285 Kb |
| 文件语言 | 英语 |
Known Good Die. ADG841-KGD. OUTLINE DIMENSIONS. 0.314 0.304 0.294. 0.820 MAX. 1.010 MAX. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 0.07 × 0.07
该数据表的模型线
文件文字版本
Known Good Die ADG841-KGD OUTLINE DIMENSIONS 0.314 0.304 0.294 0.820 MAX 1 6 5 1.010 MAX 2 3 4 TOP VIEW SIDE VIEW A (CIRCUIT SIDE) 1- 0.07 × 0.07 -201 -04 1 1
Figure 10. 6-Pad Bare Die [CHIP] (C-6-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 7. Die Specifications Parameter Value Unit
Chip Size 735 × 925 μm Scribe Line Width 85 × 85 μm Die Size 820 × 1010 μm (maximum) Thickness 304 ± 10 μm Bond Pad 70 × 70 μm (minimum) Bond Pad Composition 99.5 Al, 0.5 Cu % Backside Bare Not Applicable Passivation Nitride Not Applicable
Table 8. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Four first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADG841-KGD-CHIPS −40°C to +125°C 6-Pad Bare Die [CHIP] C-6-3
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10266-0-12/14(B)
Rev. B | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS—2.7 V TO 3.6 V SPECIFICATIONS—2.5 V ± 0.2 V SPECIFICATIONS—1.65 V TO 1.95 ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TEST CIRCUITS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 10. 6-Pad Bare Die [CHIP] (C-6-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 7. Die Specifications Parameter Value Unit
Chip Size 735 × 925 μm Scribe Line Width 85 × 85 μm Die Size 820 × 1010 μm (maximum) Thickness 304 ± 10 μm Bond Pad 70 × 70 μm (minimum) Bond Pad Composition 99.5 Al, 0.5 Cu % Backside Bare Not Applicable Passivation Nitride Not Applicable
Table 8. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Four first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADG841-KGD-CHIPS −40°C to +125°C 6-Pad Bare Die [CHIP] C-6-3
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10266-0-12/14(B)
Rev. B | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS—2.7 V TO 3.6 V SPECIFICATIONS—2.5 V ± 0.2 V SPECIFICATIONS—1.65 V TO 1.95 ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TEST CIRCUITS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE