Datasheet EL8202, EL8203, EL8403 (Renesas) - 9
| 制造商 | Renesas |
| 描述 | 500MHz Rail-to-Rail Amplifiers |
| 页数 / 页 | 16 / 9 — Typical Performance Curves. (Continued). VS=5V, AV=1, RL=1k. TO 2.5V, CL= … |
| 文件格式/大小 | PDF / 1.1 Mb |
| 文件语言 | 英语 |
Typical Performance Curves. (Continued). VS=5V, AV=1, RL=1k. TO 2.5V, CL= 2.5pF. 2.6. VS=5V, AV=5, RL=1k. to 2.5V. 2.5. VIN. 2.4. VOUT
该数据表的模型线
文件文字版本
EL8202, EL8203, EL8403
Typical Performance Curves (Continued) VS=5V, AV=1, RL=1k TO 2.5V, CL= 2.5pF 2.6 VS=5V, AV=5, RL=1k to 2.5V 2.5 VIN 5 2.4 2.5 2.6 VOUT 2.5 0 2.4 2µs/DIV 10ns/DIV FIGURE 25. SMALL SIGNAL TRANSIENT REPONSE FIGURE 26. OUTPUT SWING VS=5V, AV=5, RL=1k TO 2.5V CH1 ENABLE 5 INPUT 2.5 CH2 VOUT 0 CH1, CH2, 1V/DIV, M=100ns 2µs/DIV FIGURE 27. OUTPUT SWING FIGURE 28. ENABLED RESPONSES (EL8202) JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1 0.9 833mW (W) 0.8 ENABLE
S N J O A 1 INPUT = IO 0.7 625mW 1 4 2 CH1 T 0 A 0.6 °C/ IP 633mW W SO8 0.5
ISS 486mW JA=160°C/W D 0.4 CH2 0.3 MSOP8/10 QSOP16 V WER
OUT 0.2
JA=206°C/W JA=158°C/W PO 0.1 00 25 50 75 85 100 125 150 CH1, CH2, 0.5V/DIV, M=20ns AMBIENT TEMPERATURE (°C) FIGURE 29. DISABLED RESPONSE (EL8202) FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
FN7106 Rev 2.00 Page 9 of 16 April 26, 2006
Typical Performance Curves (Continued) VS=5V, AV=1, RL=1k TO 2.5V, CL= 2.5pF 2.6 VS=5V, AV=5, RL=1k to 2.5V 2.5 VIN 5 2.4 2.5 2.6 VOUT 2.5 0 2.4 2µs/DIV 10ns/DIV FIGURE 25. SMALL SIGNAL TRANSIENT REPONSE FIGURE 26. OUTPUT SWING VS=5V, AV=5, RL=1k TO 2.5V CH1 ENABLE 5 INPUT 2.5 CH2 VOUT 0 CH1, CH2, 1V/DIV, M=100ns 2µs/DIV FIGURE 27. OUTPUT SWING FIGURE 28. ENABLED RESPONSES (EL8202) JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1 0.9 833mW (W) 0.8 ENABLE
S N J O A 1 INPUT = IO 0.7 625mW 1 4 2 CH1 T 0 A 0.6 °C/ IP 633mW W SO8 0.5
ISS 486mW JA=160°C/W D 0.4 CH2 0.3 MSOP8/10 QSOP16 V WER
OUT 0.2
JA=206°C/W JA=158°C/W PO 0.1 00 25 50 75 85 100 125 150 CH1, CH2, 0.5V/DIV, M=20ns AMBIENT TEMPERATURE (°C) FIGURE 29. DISABLED RESPONSE (EL8202) FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
FN7106 Rev 2.00 Page 9 of 16 April 26, 2006