Datasheet BCP53; BCX53; BC53PA (Nexperia) - 4
| 制造商 | Nexperia |
| 描述 | 80 V, 1 A PNP Medium Power Transistors |
| 页数 / 页 | 22 / 4 — Nexperia. BCP53; BCX53; BC53PA. 80 V, 1 A PNP medium power transistors. … |
| 文件格式/大小 | PDF / 1.9 Mb |
| 文件语言 | 英语 |
Nexperia. BCP53; BCX53; BC53PA. 80 V, 1 A PNP medium power transistors. Limiting. values. Table 6. Limiting values. Symbol. Parameter
该数据表的模型线
文件文字版本
link to page 4 link to page 4 link to page 4 link to page 4 link to page 4 link to page 4 link to page 4 link to page 4 link to page 4 link to page 4 link to page 4
Nexperia BCP53; BCX53; BC53PA 80 V, 1 A PNP medium power transistors 5. Limiting values Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 100 V VCEO collector-emitter voltage open base - 80 V VEBO emitter-base voltage open collector - 5 V IC collector current - 1 A ICM peak collector current single pulse; - 2 A t p 1 ms IB base current - 0.3 A IBM peak base current single pulse; - 0.3 A t p 1 ms P tot total power dissipation Tamb 25 C BCP53 [1] - 0.65 W [2] - 1.00 W [3] - 1.35 W BCX53 [1] - 0.50 W [2] - 0.95 W [3] - 1.35 W BC53PA [1] - 0.42 W [2] - 0.83 W [3] - 1.10 W [4] - 0.81 W [5] - 1.65 W Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2. BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 9 — 19 October 2011 4 of 22
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
Nexperia BCP53; BCX53; BC53PA 80 V, 1 A PNP medium power transistors 5. Limiting values Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 100 V VCEO collector-emitter voltage open base - 80 V VEBO emitter-base voltage open collector - 5 V IC collector current - 1 A ICM peak collector current single pulse; - 2 A t p 1 ms IB base current - 0.3 A IBM peak base current single pulse; - 0.3 A t p 1 ms P tot total power dissipation Tamb 25 C BCP53 [1] - 0.65 W [2] - 1.00 W [3] - 1.35 W BCX53 [1] - 0.50 W [2] - 0.95 W [3] - 1.35 W BC53PA [1] - 0.42 W [2] - 0.83 W [3] - 1.10 W [4] - 0.81 W [5] - 1.65 W Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2. BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 9 — 19 October 2011 4 of 22
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents