Datasheet BlueNRG-LPS (STMicroelectronics) - 5
制造商 | STMicroelectronics |
描述 | Programmable Bluetooth Low Energy Wireless SoC |
页数 / 页 | 63 / 5 — BlueNRG-LPS. Functional overview. 1.1. System architecture. Figure 2. Bus … |
文件格式/大小 | PDF / 8.2 Mb |
文件语言 | 英语 |
BlueNRG-LPS. Functional overview. 1.1. System architecture. Figure 2. Bus matrix. DS13819. Rev 2. page 5/63
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文件文字版本
BlueNRG-LPS Functional overview 1 Functional overview 1.1 System architecture
The main system consists of 32-bit multilayer AHB bus matrix that interconnects: • Three masters: – CPU (Cortex®-M0+) core S-bus – DMA1 – Radio system • Seven slaves: – Internal Flash memory on CPU (Cortex®-M0+) S bus – Internal SRAM0 (12 kB) – Internal SRAM1 (12 kB) – APB0 peripherals (through an AHB to APB bridge) – APB1 peripherals (through an AHB to APB bridge) – AHB0 peripherals – AHBRF including AHB to APB bridge and radio peripherals (connected to APB2) The bus matrix provides access from a master to a slave, enabling concurrent access and efficient operation even when several high-speed peripherals work simultaneously.
Figure 2. Bus matrix
CPU ARM Radio DMA 1 Cortex-M0+ system S0 S1 S2 Flash Flash M0 Controller M1 SRAM0 SRAM1 M2 APB0 M3 APB1 M4 AHB0 M5 APB2 M6 Bus Matrix
DS13819
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Rev 2 page 5/63
Document Outline Features Applications Description 1 Functional overview 1.1 System architecture 1.2 Arm® Cortex®-M0+ core with MPU 1.3 Memories 1.3.1 Embedded Flash memory 1.3.2 Embedded SRAM 1.3.3 Embedded ROM 1.3.4 Embedded OTP 1.3.5 Memory protection unit (MPU) 1.4 Security and safety 1.5 RF subsystem 1.5.1 RF front-end block diagram 1.6 Power supply management 1.6.1 SMPS step-down regulator 1.6.2 Power supply schemes 1.6.3 Linear voltage regulators 1.6.4 Power supply supervisor 1.7 Operating modes 1.7.1 RUN mode 1.7.2 DEEPSTOP mode 1.7.3 SHUTDOWN mode 1.8 Reset management 1.9 Clock management 1.10 Boot mode 1.11 Embedded UART bootloader 1.12 General purpose inputs/outputs (GPIO) 1.13 Direct memory access (DMA) 1.14 Nested vectored interrupt controller (NVIC) 1.15 Analog digital converter (ADC) 1.15.1 Temperature sensor 1.16 True random number generator (RNG) 1.17 Timers and watchdog 1.17.1 General-purpose timers (TIM2, TIM16, TIM17) 1.17.2 Independent watchdog (IWDG) 1.17.3 SysTick timer 1.18 Real-time clock (RTC) 1.19 Inter-integrated circuit interface (I2C) 1.20 Universal synchronous/asynchronous receiver transmitter (USART) 1.21 LPUART 1.22 Serial peripheral interface (SPI) 1.23 Inter-IC sound (I2S) 1.24 Serial wire debug port 1.25 TX and RX event alert 1.26 Direction finding 2 Pinouts and pin description 3 Memory mapping 4 Application circuits 5 Electrical characteristics 5.1 Parameter conditions 5.1.1 Minimum and maximum values 5.1.2 Typical values 5.1.3 Typical curves 5.1.4 Loading capacitor 5.1.5 Pin input voltage 5.2 Absolute maximum ratings 5.3 Operating conditions 5.3.1 Summary of main performance 5.3.2 General operating conditions 5.3.3 RF general characteristics 5.3.4 RF transmitter characteristics 5.3.5 RF receiver characteristics 5.3.6 Embedded reset and power control block characteristics 5.3.7 Supply current characteristics 5.3.8 Wake-up time from low power modes 5.3.9 High speed crystal requirements 5.3.10 Low speed crystal requirements 5.3.11 High speed ring oscillator characteristics 5.3.12 Low speed ring oscillator characteristics 5.3.13 PLL characteristics 5.3.14 Flash memory characteristics 5.3.15 Electrostatic discharge (ESD) 5.3.16 I/O port characteristics 5.3.17 RSTN pin characteristics 5.3.18 ADC characteristics 5.3.19 Temperature sensor characteristics 5.3.20 Timer characteristics 5.3.21 I2C interface characteristics 5.3.22 SPI characteristics 6 Package information 6.1 QFN32 (5x5x0.9, pitch 0.5 mm) package information 6.2 WLCSP36 package information 6.3 Thermal characteristics 7 Ordering information Revision history