Datasheet TMP35, TMP36, TMP37 (Analog Devices) - 4

TMP35/TMP36/TMP37 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter1, 2 Rating
Ratings may cause permanent damage to the product. This is a Supply Voltage 7 V stress rating only; functional operation of the product at these Shutdown Pin GND ≤ SHUTDOWN ≤ +VS or any other conditions above those indicated in the operational Output Pin GND ≤ VOUT ≤ +VS section of this specification is not implied. Operation beyond Operating Temperature Range −55°C to +150°C the maximum operating conditions for extended periods may Die Junction Temperature 175°C affect product reliability. Storage Temperature Range −65°C to +160°C
THERMAL RESISTANCE
IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) θJA is specified for the worst-case conditions, that is, a device in Time at Peak Temperature Range 10 sec to 20 sec socket. Ramp-Up Rate 3°C/sec
Table 3. Thermal Resistance
Ramp-Down Rate −6°C/sec
Package Type θJA θJC Unit
Time 25°C to Peak Temperature 6 min TO-92 (T-3-1) 162 120 °C/W IR Reflow Soldering—Pb-Free Package SOIC_N (R-8) 158 43 °C/W Peak Temperature 260°C (0°C) SOT-23 (RJ-5) 300 180 °C/W Time at Peak Temperature Range 20 sec to 40 sec Ramp-Up Rate 3°C/sec Ramp-Down Rate −6°C/sec
ESD CAUTION
Time 25°C to Peak Temperature 8 min 1 Digital inputs are protected; however, permanent damage can occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures. 2 Remove power before inserting or removing units from their sockets. Rev. H | Page 4 of 19