Datasheet TMP35, TMP36, TMP37 (Analog Devices) - 7

Data Sheet TMP35/TMP36/TMP37 110 a 100 10mV 1ms 90 100 b c +VS = 3V, 5V 80 90 70 %) ( E 60 50 CHANG VOLT/DIVISION 40 a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB 30 b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB 10 c. TMP35 TO-92 IN SOCKET SOLDERED TO 0% 20 1" × 0.4" Cu PCB 10
034 00337-019
0
00337-
0 100 200 300 400 500 600 TIME/DIVISION TIME (s)
Figure 17. Thermal Response Time in Still Air Figure 20. Temperature Sensor Wideband Output Noise Voltage; Gain = 100, BW = 157 kHz
140 2400 a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB 2200 120 b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB c. TMP35 TO-92 IN SOCKET SOLDERED TO 2000 1" × 0.4" Cu PCB b 1800 100 s) ( 1600 ANT 80 1400 T +V NS S = 3V, 5V 1200 60 CO 1000 E IM b T 800 40 c 600 a 20 VOLTAGE NOISE DENSITY (nV/ Hz) 400 a. TMP35/TMP36
018
b. TMP37 200 a 0
00337-
0
00337-020
0 100 200 300 400 500 600 700 10 100 1k 10k AIR VELOCITY (FPM) FREQUENCY (Hz)
Figure 18. Thermal Response Time Constant in Forced Air Figure 21. Voltage Noise Spectral Density vs. Frequency
110 a 100 90 c +VS = 3V, 5V 80 b 70 %) ( 60 E 50 CHANG 40 a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB 30 b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB c. TMP35 TO-92 IN SOCKET SOLDERED TO 20 1" × 0.4" Cu PCB 10
035
0
00337-
0 10 20 30 40 50 60 TIME (s)
Figure 19. Thermal Response Time in Stirred Oil Bath Rev. H | Page 7 of 19